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1. (WO2018143726) HEAT PUMP SYSTEM

Pub. No.:    WO/2018/143726    International Application No.:    PCT/KR2018/001455
Publication Date: Fri Aug 10 01:59:59 CEST 2018 International Filing Date: Sat Feb 03 00:59:59 CET 2018
IPC: F25B 41/00
F25B 49/02
Applicants: SAMSUNG ELECTRONICS CO., LTD.
삼성전자주식회사
Inventors: SAITO, Masaki
사이토마사키
TAKAHARA, Takeshi
타카하라타케시
KODA, Kimio
코다키미오
TAJIMA, Kazushige
타지마카즈시게
Title: HEAT PUMP SYSTEM
Abstract:
The present invention relates to a heat pump system comprising: an outdoor unit installed in an outdoor space; a plurality of heat load units supplied with cold air and warm air; and an intermediate unit arranged between the outdoor unit and the plurality of heat load units, wherein the intermediate unit is connected to the outdoor unit through a refrigerant tube and is connected to the plurality of heat load units through a heat medium tube.