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1. (WO2018143681) LIGHT-EMITTING DIODE PACKAGE

Pub. No.:    WO/2018/143681    International Application No.:    PCT/KR2018/001366
Publication Date: Fri Aug 10 01:59:59 CEST 2018 International Filing Date: Fri Feb 02 00:59:59 CET 2018
IPC: H01L 33/58
H01L 33/48
H01L 33/50
H01L 33/44
Applicants: SEOUL SEMICONDUCTOR CO., LTD
서울반도체주식회사
Inventors: HONG, Seung Sik
홍승식
TAKEYA, Motonobu
타케야모토노부
Title: LIGHT-EMITTING DIODE PACKAGE
Abstract:
The present invention relates to a light-emitting diode package. A light-emitting diode package according to an embodiment of the present invention can comprise: a light-emitting diode chip; a phosphor layer covering the upper part of the light-emitting diode chip and for wavelength-converting a light emitted from the light-emitting diode chip; and a color filter layer covering the upper part of the phosphor layer and for blocking a light of some wavelengths from the light being emitted through the phosphor layer. According to the present invention, when a red light is produced by means of a blue light-emitting diode chip or an ultraviolet ray emitting diode chip and a phosphor without using a red light-emitting diode chip, a blue light or ultraviolet ray is blocked by means of the color filter layer coated on the phosphor layer when the blue light or the ultraviolet ray is emitted with the red light, and thus only the red light can be emitted outside.