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1. (WO2018143530) CARRIER HEAD FOR CHEMICAL MECHANICAL POLISHING DEVICE, INCLUDING CONTACT FLAP

Pub. No.:    WO/2018/143530    International Application No.:    PCT/KR2017/009627
Publication Date: Fri Aug 10 01:59:59 CEST 2018 International Filing Date: Tue Sep 05 01:59:59 CEST 2017
IPC: H01L 21/304
H01L 21/306
B24B 37/32
B24B 41/00
H01L 21/321
Applicants: KANG, Joon Mo
강준모
Inventors: KANG, Joon Mo
강준모
Title: CARRIER HEAD FOR CHEMICAL MECHANICAL POLISHING DEVICE, INCLUDING CONTACT FLAP
Abstract:
The present invention relates to a carrier head for a chemical mechanical polishing device, including a contact flap. According to the present invention, the carrier head comprises: a base; a substrate accommodation member connected to the lower part of the base, and having an outer surface, which is a substrate accommodation surface, and an inner surface opposite to the outer surface; at least one contact flap, which has a connecting portion connected, on the inside of the substrate accommodation member, to the lower part of the base, a flap side portion downwardly extended from the connecting portion, and a contact portion extended in the side direction at the lower end of the flap side portion; and at least one barrier structure connected to the lower part of the base, and arranged adjacently to the at least one contact flap, wherein the at least one barrier structure is formed such that the contact portion comes into close contact with the inner surface by fluid pressure by limiting the expansion of the at least one contact flap.