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1. (WO2018143501) METHOD FOR MANUFACTURING FINE-PITCH ANISOTROPIC CONDUCTIVE ADHESIVE AND FINE-PITCH ANISOTROPIC CONDUCTIVE ADHESIVE MANUFACTURED BY SAME METHOD
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Pub. No.: WO/2018/143501 International Application No.: PCT/KR2017/001283
Publication Date: 09.08.2018 International Filing Date: 06.02.2017
IPC:
C09J 9/02 (2006.01) ,C09J 11/06 (2006.01) ,C09J 11/04 (2006.01) ,C09J 7/00 (2006.01)
C CHEMISTRY; METALLURGY
09
DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
J
ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
9
Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
02
Electrically-conducting adhesives
C CHEMISTRY; METALLURGY
09
DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
J
ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
11
Features of adhesives not provided for in group C09J9/76
02
Non-macromolecular additives
06
organic
C CHEMISTRY; METALLURGY
09
DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
J
ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
11
Features of adhesives not provided for in group C09J9/76
02
Non-macromolecular additives
04
inorganic
C CHEMISTRY; METALLURGY
09
DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
J
ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
7
Adhesives in the form of films or foils
Applicants:
이경섭 LEE, Kyung Sub [KR/KR]; KR
Inventors:
이경섭 LEE, Kyung Sub; KR
Agent:
한상수 HAN, Sang Soo; KR
Priority Data:
Title (EN) METHOD FOR MANUFACTURING FINE-PITCH ANISOTROPIC CONDUCTIVE ADHESIVE AND FINE-PITCH ANISOTROPIC CONDUCTIVE ADHESIVE MANUFACTURED BY SAME METHOD
(FR) PROCÉDÉ DE FABRICATION D'UN ADHÉSIF CONDUCTEUR ANISOTROPE À PAS FIN ET ADHÉSIF CONDUCTEUR ANISOTROPE À PAS FIN AINSI OBTENU
(KO) 미세피치용 이방성 도전 접착제 제조방법 및 이 방법에 의해 제조된 미세피치용 이방성 도전 접착제
Abstract:
(EN) The present invention relates to a method for manufacturing a fine-pitch anisotropic conductive adhesive, and a fine-pitch anisotropic conductive adhesive manufactured by the method. The method for manufacturing a fine-pitch anisotropic conductive adhesive comprises the steps of: (i) removing, by using a first reducing agent, an oxide film of solder particles which are melted within a predetermined temperature range and have a function of being self-fused and self-oriented between metal terminals of a substrate; (ii) removing moisture generated in step (i); and (iii) mixing a binder resin with the solder particles from which the oxide film and the moisture were removed in steps (i) and (ii) to produce an anisotropic conductive adhesive, wherein step (iii) is performed in a state where contact with oxygen is prevented.
(FR) La présente invention concerne un procédé de fabrication d'un adhésif conducteur anisotrope à pas fin, et l'adhésif conducteur anisotrope à pas fin ainsi obtenu. Le procédé de fabrication d'un adhésif conducteur anisotrope à pas fin selon l'invention comprend les étapes suivantes : (i) l'élimination, à l'aide d'un premier agent réducteur, du film d'oxyde qui s'est formé sur des particules de brasure lors de leur fusion dans une plage de températures prédéfinie et ayant une fonction d'auto-fusion et d'auto-orientation entre les bornes métalliques d'un substrat ; (ii) l'élimination de l'humidité générée à l'étape (i) ; et (iii) le mélange d'une résine liante avec les particules de brasure dont le film d'oxyde et l'humidité ont été éliminés aux étapes (i) et (ii) pour obtenir un adhésif conducteur anisotrope, où l'étape (iii) est effectuée dans une condition d'absence de contact avec l'oxygène.
(KO) 본 발명은 미세피치용 이방성 도전 접착제 제조방법 및 이 방법에 의해 제조된 미세피치용 이방성 도전 접착제에 관한 것으로, (i) 제1 환원제를 이용하여 일정온도 범위에서 용융되어 기판의 금속단자 사이에 자가융착 및 자가배향하는 기능을 구비하는 솔더입자의 산화막을 제거시키는 단계; (ii) 상기 (i)단계 중 생성되는 수분을 제거하는 단계; (iii) 상기 (i)단계 및 (ii)단계에서 산화막 및 수분이 제거된 솔더입자와 바인더 수지를 혼합하여 이방성 도전 접착제를 제조하는 단계; 를 포함하여 이루어지고, 상기 (iii)단계는 산소와의 접촉이 차단되어있는 상태에서 수행되는 것을 특징으로 하는 미세피치용 이방성 도전 접착제 제조방법을 제공한다.
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Korean (KO)
Filing Language: Korean (KO)