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1. (WO2018143410) ULTRASONIC BONDING DEVICE, ULTRASONIC BONDING INSPECTION METHOD, AND METHOD FOR MANUFACTURING ULTRASONIC BONDING UNIT

Pub. No.:    WO/2018/143410    International Application No.:    PCT/JP2018/003605
Publication Date: Fri Aug 10 01:59:59 CEST 2018 International Filing Date: Sat Feb 03 00:59:59 CET 2018
IPC: H01L 21/607
B23K 20/10
G01H 17/00
G01N 29/14
H01L 21/60
Applicants: MITSUBISHI ELECTRIC CORPORATION
三菱電機株式会社
Inventors: EGUSA Minoru
江草 稔
SUDO Shingo
須藤 進吾
HASHIMOTO Kazuyuki
橋本 和幸
SUZUKI Erubi
鈴木 得未
Title: ULTRASONIC BONDING DEVICE, ULTRASONIC BONDING INSPECTION METHOD, AND METHOD FOR MANUFACTURING ULTRASONIC BONDING UNIT
Abstract:
An ultrasonic bonding device (50) comprises: an ultrasonic bonding machine (20) that has an ultrasonic tool (21) for applying ultrasonic waves while pressing bonding members (4, 5) on a member to be bonded (10) mounted on an object to be fixed (1) that is fixed on a jig (24); and a bonding inspection device (30) that inspects the bonding quality of the member to be bonded (10) with the bonding members (4, 5). The bonding inspection device (30) comprises: a bonding state measurement device (31) that detects vibration in a jig (24) or a housing (28) of the ultrasonic bonding machine (20) in which the jig (24) is installed, and outputs a detection signal (sig1); and a bonding state determination device (32) that, in a step for bonding the member to be bonded (10) and the bonding members (4, 5), determines the bonding state of the member to be bonded (10) with the bonding members (4, 5) on the basis of the detection signal (sig1) outputted by the bonding state measurement device (31).