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1. (WO2018143224) RESIN COMPOUND AND MOLDED PRODUCT OF RESIN COMPOUND

Pub. No.:    WO/2018/143224    International Application No.:    PCT/JP2018/003074
Publication Date: Fri Aug 10 01:59:59 CEST 2018 International Filing Date: Thu Feb 01 00:59:59 CET 2018
IPC: C08L 101/00
C01B 32/20
C08K 3/04
Applicants: NTI CO., LTD.
NTI株式会社
Inventors: MISE, Nobutake
見勢 信猛
Title: RESIN COMPOUND AND MOLDED PRODUCT OF RESIN COMPOUND
Abstract:
[Problem] To provide: a thermally conductive resin compound having high thermal conductivity, excellent moldability, and high mechanical strength; and a molded product of the resin compound. [Solution] The present invention provides a resin compound containing a thermoplastic resin and graphite, the resin compound further containing carbon black having a nitrogen adsorption specific surface area of 10-100 m2/g and/or a DBP absorption of 30-100 ml/100 g.