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1. (WO2018143222) SEMICONDUCTOR CHIP MOUNTING APPARATUS AND SEMICONDUCTOR CHIP MOUNTING METHOD

Pub. No.:    WO/2018/143222    International Application No.:    PCT/JP2018/003048
Publication Date: Fri Aug 10 01:59:59 CEST 2018 International Filing Date: Wed Jan 31 00:59:59 CET 2018
IPC: H01L 21/60
H01L 21/52
H01L 25/065
H01L 25/07
H01L 25/18
H05K 3/32
H05K 3/34
Applicants: SHINKAWA LTD.
株式会社新川
Inventors: HAGIWARA Yoshihito
萩原 美仁
NAKAMURA Tomonori
中村 智宣
HORIBE Hiroshi
堀部 裕史
Title: SEMICONDUCTOR CHIP MOUNTING APPARATUS AND SEMICONDUCTOR CHIP MOUNTING METHOD
Abstract:
This mounting apparatus comprises: a bonding head 14 that bonds, while pressing, a semiconductor chip 100 onto a substrate 110 or another semiconductor chip 100; and a heating mechanism 16 that heats the semiconductor chip 100 from the side during the execution of this bonding. After two or more semiconductor chips 100 are stacked while being bonded by temporary pressure-bonding, the bonding head 14 heats and applies pressure to an upper surface of the resultant stacked body, thereby integrally pressure-bonding the two or more semiconductor chips 100, and at the time of this pressure-bonding the heating mechanism 16 heats the stacked body from the side.