Search International and National Patent Collections

1. (WO2018143110) POLYAMIDE RESIN COMPOSITION AND MOLDED BODY FORMED BY MOLDING SAME

Pub. No.:    WO/2018/143110    International Application No.:    PCT/JP2018/002607
Publication Date: Fri Aug 10 01:59:59 CEST 2018 International Filing Date: Tue Jan 30 00:59:59 CET 2018
IPC: C08L 77/00
C08K 3/26
C08K 5/098
C08K 5/24
C08K 5/5313
Applicants: UNITIKA LTD.
ユニチカ株式会社
Inventors: MASAKI Tatsunori
正木 辰典
KAMIKAWA Hiroo
上川 泰生
MII Junichi
三井 淳一
Title: POLYAMIDE RESIN COMPOSITION AND MOLDED BODY FORMED BY MOLDING SAME
Abstract:
Provided is a polyamide resin composition characterized by containing a semi-aromatic polyamide (A) having a melting point of 280-320°C, an aliphatic polyamide (B), 5-30 mass% of a metal phosphinate salt (C), 5-60 mass% of a reinforcing material (D), 0.1-8 mass% of a metal carbonate salt (E), and 0.01-3 mass% of a fatty acid barium salt (F), wherein the sum content of (A) and (B) is 30-85 mass%, and the mass ratio (A/B) of (A) to (B) is 90/10-40/60.