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1. (WO2018142834) ELECTRONIC COMPONENT, CAMERA MODULE, AND ELECTRONIC COMPONENT PRODUCTION METHOD

Pub. No.:    WO/2018/142834    International Application No.:    PCT/JP2017/047355
Publication Date: Fri Aug 10 01:59:59 CEST 2018 International Filing Date: Fri Dec 29 00:59:59 CET 2017
IPC: H04N 5/225
G03B 17/02
H04N 5/359
Applicants: SONY SEMICONDUCTOR SOLUTIONS CORPORATION
ソニーセミコンダクタソリューションズ株式会社
Inventors: MOMIUCHI, Yuta
籾内 雄太
ITOTANI, Ryo
糸谷 良
NAKAYAMA, Hirokazu
中山 浩和
KAI, Tooru
甲斐 亮
TOGAWA, Miyoshi
戸川 実栄
Title: ELECTRONIC COMPONENT, CAMERA MODULE, AND ELECTRONIC COMPONENT PRODUCTION METHOD
Abstract:
[Problem] To enable downsizing of a structure and suppress deterioration of image quality. [Solution] Provided is an electronic component comprising: a circuit board having a first surface, a second surface on a side opposite to the first surface, and a first opening section; a translucent member provided opposite the first surface of the circuit board; an image capturing element flip-chip mounted on the second surface of the circuit board and having a light-receiving surface on a side opposing the translucent member; and a light-absorbing member provided between the circuit board and the translucent member, and formed in a region of the first surface of the circuit board excluding the first opening section in a plan view.