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|1. (WO2018142834) ELECTRONIC COMPONENT, CAMERA MODULE, AND ELECTRONIC COMPONENT PRODUCTION METHOD|
|Applicants:||SONY SEMICONDUCTOR SOLUTIONS CORPORATION
|Title:||ELECTRONIC COMPONENT, CAMERA MODULE, AND ELECTRONIC COMPONENT PRODUCTION METHOD|
[Problem] To enable downsizing of a structure and suppress deterioration of image quality. [Solution] Provided is an electronic component comprising: a circuit board having a first surface, a second surface on a side opposite to the first surface, and a first opening section; a translucent member provided opposite the first surface of the circuit board; an image capturing element flip-chip mounted on the second surface of the circuit board and having a light-receiving surface on a side opposing the translucent member; and a light-absorbing member provided between the circuit board and the translucent member, and formed in a region of the first surface of the circuit board excluding the first opening section in a plan view.