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1. (WO2018142733) SOLDERING APPARATUS
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Pub. No.: WO/2018/142733 International Application No.: PCT/JP2017/042460
Publication Date: 09.08.2018 International Filing Date: 27.11.2017
IPC:
B23K 3/02 (2006.01) ,B23K 3/06 (2006.01) ,H05K 3/34 (2006.01) ,B23K 101/42 (2006.01)
B PERFORMING OPERATIONS; TRANSPORTING
23
MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
K
SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
3
Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
02
Soldering irons; Bits
B PERFORMING OPERATIONS; TRANSPORTING
23
MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
K
SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
3
Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
06
Solder feeding devices; Solder melting pans
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3
Apparatus or processes for manufacturing printed circuits
30
Assembling printed circuits with electric components, e.g. with resistor
32
electrically connecting electric components or wires to printed circuits
34
by soldering
B PERFORMING OPERATIONS; TRANSPORTING
23
MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
K
SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
101
Articles made by soldering, welding or cutting
36
Electric or electronic devices
42
Printed circuits
Applicants:
株式会社日立製作所 HITACHI, LTD. [JP/JP]; 東京都千代田区丸の内一丁目6番6号 6-6, Marunouchi 1-chome, Chiyoda-ku, Tokyo 1008280, JP
Inventors:
平岡 和 HIRAOKA Miki; JP
河喜多 心哉 KAWAKITA Shinya; JP
京井 正之 KYOI Masayuki; JP
池田 靖 IKEDA Osamu; JP
Agent:
青稜特許業務法人 SEIRYO I.P.C.; 東京都中央区八丁堀二丁目24番2号 24-2, Hatchobori 2-chome, Chuo-ku, Tokyo 1040032, JP
Priority Data:
2017-01663101.02.2017JP
Title (EN) SOLDERING APPARATUS
(FR) APPAREIL DE BRASAGE
(JA) 半田付け装置
Abstract:
(EN) Provided is a soldering apparatus whereby work time for soldering can be reduced and non-wetting of solder can be suppressed. A soldering apparatus 100 having a plurality of cylindrical solder-piece guiding pipes 10 having a space through which solder pieces supplied from a supply port are passed, a first retaining part 20 for retaining the solder-piece guiding pipes 10, and a heating part 40 for heating the first retaining part 20, a distal-end part 102 on a soldering side of a solder-piece guiding pipe 40 being disposed on the inside of the first retaining part 20.
(FR) L'invention concerne un appareil de brasage grâce auquel il est possible de réduire le temps de travail de brasage et de supprimer le non-mouillage de la brasure. Un appareil de brasage 100 comprend une pluralité de conduits cylindriques de guidage de pièces de brasure 10 comportant un espace à travers lequel passent des pièces de brasure alimentées depuis un orifice d'alimentation, une première partie 20 de retenue destinée à retenir les conduits de guidage de pièces de brasure 10, et une partie de chauffe 40 destinée à chauffer la première partie de retenue 20, une partie d'extrémité distale 102 située d'un côté brasage d'un conduit de guidage de pièces de brasure 40 étant disposée à l'intérieur de la première partie de retenue 20.
(JA) 半田付けの作業時間を短縮することができ、かつ半田の未ぬれを抑制することができる半田付け装置を提供する。 供給口から供給される半田片を通過させる空間を有する、複数の筒状の半田片誘導管10と、半田片誘導管10を保持する第一保持部20と、第一保持部20を加熱する加熱部40と、を有し、半田片誘導管40の、半田付けする側の先端部102が、第一保持部20の内側に配設されている半田付け装置100である。
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)