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1. (WO2018142720) METHOD FOR MANUFACTURING WIRING STRUCTURE

Pub. No.:    WO/2018/142720    International Application No.:    PCT/JP2017/041137
Publication Date: Fri Aug 10 01:59:59 CEST 2018 International Filing Date: Thu Nov 16 00:59:59 CET 2017
IPC: H01L 21/3205
C23C 2/08
H01L 21/768
H01L 23/14
H01L 23/522
Applicants: SUMITOMO PRECISION PRODUCTS CO., LTD.
住友精密工業株式会社
Inventors: YAMAGUCHI Yukitaka
山口 征隆
Title: METHOD FOR MANUFACTURING WIRING STRUCTURE
Abstract:
The method for manufacturing a wiring structure according to the present invention comprises the steps for: preparing a substrate (10) having a wiring layer (13) formed on the surface thereof with an insulating layer (11) interposed therebetween; etching the back surface of the substrate to form a via (20) that passes through an insulating layer and has a bottom section where the underlying wiring layer is positioned; forming a first metal layer (15) and a second metal layer (16) on the wiring layer at the bottom section of the via; and filling the via with a Sn-based molten metal 17, wherein the wiring layer is made of Al, Al alloy or Cu, the first metal layer is made of a material to be alloyed with the Sn-based molten metal, and the second metal layer is made of a material that prevents oxidation of the first metal layer