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1. (WO2018142577) CIRCUIT FORMATION METHOD AND CIRCUIT FORMATION DEVICE

Pub. No.:    WO/2018/142577    International Application No.:    PCT/JP2017/003972
Publication Date: Fri Aug 10 01:59:59 CEST 2018 International Filing Date: Sat Feb 04 00:59:59 CET 2017
IPC: H05K 3/10
H05K 1/18
H05K 3/12
H05K 3/22
H05K 3/32
H05K 3/40
Applicants: FUJI CORPORATION
株式会社FUJI
Inventors: TSUKADA, Kenji
塚田 謙磁
KAWAJIRI, Akihiro
川尻 明宏
HASHIMOTO, Yoshitaka
橋本 良崇
MAKIHARA, Katsuaki
牧原 克明
TAKEUCHI, Tasuku
竹内 佑
Title: CIRCUIT FORMATION METHOD AND CIRCUIT FORMATION DEVICE
Abstract:
A circuit formation method, including: a first wiring formation step for forming wiring by discharging in linear form a metal-containing liquid that contains metal microparticles, and performing laser irradiation on that metal-containing liquid; and a connection step for connecting an electrically conductive part with the wiring formed in the first wiring formation step using an electrically conductive curing resin.