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1. (WO2018142516) POLISHING FLUID, POLISHING FLUID SET, AND POLISHING METHOD

Pub. No.:    WO/2018/142516    International Application No.:    PCT/JP2017/003645
Publication Date: Fri Aug 10 01:59:59 CEST 2018 International Filing Date: Thu Feb 02 00:59:59 CET 2017
IPC: C09K 3/14
B24B 37/00
H01L 21/304
Applicants: HITACHI CHEMICAL COMPANY, LTD.
日立化成株式会社
Inventors: AKUTSU Toshiaki
阿久津 利明
HOSHI Yousuke
星 陽介
AOKI Masako
青木 雅子
Title: POLISHING FLUID, POLISHING FLUID SET, AND POLISHING METHOD
Abstract:
Provided is a polishing fluid that contains: abrasive grains containing the hydroxide of a tetravalent metal element; a polyalkylene glycol; a polymer compound; a cationic polymer; and a liquid medium. The polymer compound has a first molecular chain to which a functional group is directly bonded and a second molecular chain that branches from the first molecular chain. The functional group includes at least one selected from the group consisting of the carboxyl group and carboxylate salt groups.