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|1. (WO2018142516) POLISHING FLUID, POLISHING FLUID SET, AND POLISHING METHOD|
|Applicants:||HITACHI CHEMICAL COMPANY, LTD.
|Title:||POLISHING FLUID, POLISHING FLUID SET, AND POLISHING METHOD|
Provided is a polishing fluid that contains: abrasive grains containing the hydroxide of a tetravalent metal element; a polyalkylene glycol; a polymer compound; a cationic polymer; and a liquid medium. The polymer compound has a first molecular chain to which a functional group is directly bonded and a second molecular chain that branches from the first molecular chain. The functional group includes at least one selected from the group consisting of the carboxyl group and carboxylate salt groups.