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1. (WO2018142051) ELECTRONIC CARD WITH PRINTED CIRCUIT COMPRISING AN ANTENNA WITH INTEGRATED SLOTS AND METHOD FOR THE PRODUCTION THEREOF
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Pub. No.: WO/2018/142051 International Application No.: PCT/FR2018/050195
Publication Date: 09.08.2018 International Filing Date: 29.01.2018
IPC:
H01Q 13/18 (2006.01) ,H05K 1/18 (2006.01) ,H05K 3/46 (2006.01) ,H01Q 21/06 (2006.01) ,H01L 21/48 (2006.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
Q
AERIALS
13
Waveguide horns or mouths; Slot aerials; Leaky-waveguide aerials; Equivalent structures causing radiation along the transmission path of a guided wave
10
Resonant slot aerials
18
the slot being backed by, or formed in boundary wall of, a resonant cavity
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1
Printed circuits
18
Printed circuits structurally associated with non-printed electric components
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3
Apparatus or processes for manufacturing printed circuits
46
Manufacturing multi-layer circuits
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
Q
AERIALS
21
Aerial arrays or systems
06
Arrays of individually energised aerial units similarly polarised and spaced apart
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21
Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02
Manufacture or treatment of semiconductor devices or of parts thereof
04
the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer
48
Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups H01L21/06-H01L21/326201
Applicants:
INSTITUT VEDECOM [FR/FR]; 77 rue des Chantiers 78000 Versailles, FR
Inventors:
KIEL, Friedbald; FR
Agent:
MENES, Catherine; FR
Priority Data:
175085101.02.2017FR
Title (EN) ELECTRONIC CARD WITH PRINTED CIRCUIT COMPRISING AN ANTENNA WITH INTEGRATED SLOTS AND METHOD FOR THE PRODUCTION THEREOF
(FR) CARTE ÉLECTRONIQUE À CIRCUIT IMPRIMÉ COMPRENANT UNE ANTENNE À FENTES INTÉGRÉE ET PROCÉDÉ DE FABRICATION DE CELLE-CI
Abstract:
(EN) The electronic card with printed circuit (1) comprises at least one antenna with slots (AT) including a cavity (15) and a metal conductive layer (17) covering the cavity and having a plurality of slots (S17). The slots form openings in the metal conductive layer. In accordance with the invention, the cavity is formed, by removal of material, in the thickness of the printed circuit. The cavity also comprises a metallisation layer (16) on the walls and the metal conductive layer is formed in a plate attached on the electronic card with printed circuit and closes the cavity.
(FR) La carte électronique à circuit imprimé (1) comprend au moins une antenne à fentes (AT) incluant une cavité (15) et une couche conductrice métallique (17) recouvrant la cavité et ayant une pluralité de fentes (S17). Les fentes forment des ouvertures dans la couche conductrice métallique. Conformément à l'invention, la cavité est formée, par retrait de matière, dans l'épaisseur du circuit imprimé. La cavité comporte aussi une couche de métallisation (16) sur des parois et la couche conductrice métallique est formée dans une plaque rapportée sur la carte électronique à circuit imprimé et ferme la cavité.
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: French (FR)
Filing Language: French (FR)