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1. (WO2018141568) METHOD FOR JOINING COMPONENTS ON A SUPPORT STRUCTURE USING ELECTROMAGNETIC RADIATION

Pub. No.:    WO/2018/141568    International Application No.:    PCT/EP2018/051450
Publication Date: Fri Aug 10 01:59:59 CEST 2018 International Filing Date: Tue Jan 23 00:59:59 CET 2018
IPC: B23K 1/00
B23K 1/005
B23K 1/20
H05K 3/34
B23K 101/42
Applicants: FRAUNHOFER-GESELLSCHAFT ZUR FÖRDERUNG DER ANGEWANDTEN FORSCHUNG E. V.
Inventors: LÖHRING, Jens
HOFFMANN, Hans-Dieter
TRAUB, Martin
WINZEN, Matthias
BRANDENBURG, Wolfgang
FAIDEL, Heinrich
JANSSEN, Michael
PLUM, Heinz-Dieter
Title: METHOD FOR JOINING COMPONENTS ON A SUPPORT STRUCTURE USING ELECTROMAGNETIC RADIATION
Abstract:
The present invention relates to a method for joining components (2), in particular micro-optical components, on a support structure (1) using electromagnetic radiation (4). In the method, a solder (3) is applied to at least one of in each case two surface areas that are to be connected of the components (1, 2) to be joined or introduced between in each case two surface areas that are to be connected of the components (1, 2) to be joined. The surface areas that are to be connected are then positively connected to one another by melting the solder (3) with the aid of electromagnetic radiation (4) and subsequent cooling. In the method, an active solder (3) is used as a solder, which, in the absence of a flow means, achieves a wetting of the surface areas that are to be connected, which is sufficient for producing the solder connection. The electromagnetic radiation (4) is directed through one of the components to be joined (1), which is at least partially permeable to the electromagnetic radiation (4), onto the active solder (3). By using the proposed method, in particular optical components (2) can be connected with a support structure (1) in a simple manner without the use of expensive additional coatings.