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1. (WO2018140345) INTERCONNECT STRUCTURE FOR ELECTRICAL CONNECTING A PAIR OF MICROWAVE TRANSMISSION LINES FORMED ON A PAIR OF SPACED STRUCTURE MEMBERS
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Pub. No.: WO/2018/140345 International Application No.: PCT/US2018/014653
Publication Date: 02.08.2018 International Filing Date: 22.01.2018
IPC:
H01P 5/02 (2006.01) ,H01P 11/00 (2006.01) ,H05K 1/14 (2006.01) ,H01L 23/00 (2006.01) ,H01L 23/66 (2006.01) ,H01P 1/04 (2006.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
P
WAVEGUIDES; RESONATORS, LINES OR OTHER DEVICES OF THE WAVEGUIDE TYPE
5
Coupling devices of the waveguide type
02
with invariable factor of coupling
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
P
WAVEGUIDES; RESONATORS, LINES OR OTHER DEVICES OF THE WAVEGUIDE TYPE
11
Apparatus or processes specially adapted for manufacturing waveguides or resonators, lines, or other devices of the waveguide type
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1
Printed circuits
02
Details
14
Structural association of two or more printed circuits
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23
Details of semiconductor or other solid state devices
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23
Details of semiconductor or other solid state devices
58
Structural electrical arrangements for semiconductor devices not otherwise provided for
64
Impedance arrangements
66
High-frequency adaptations
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
P
WAVEGUIDES; RESONATORS, LINES OR OTHER DEVICES OF THE WAVEGUIDE TYPE
1
Auxiliary devices
04
Fixed joints
Applicants:
RAYTHEON COMPANY [US/US]; 870 Winter Street Waltham, MA 02451-1449, US
Inventors:
TRULLI, Susan, C.; US
LAIGHTON, Christopher, M.; US
HARPER, Elicia, K.; US
Agent:
MOFFORD, Donald, F.; US
ROBINSON, Kermit; US
DURKEE, Paul, D.; US
MILMAN, Seth, A.; US
MOOSEY, Anthony, T.; US
DALY, Christopher, S.; US
CROWLEY, Judith, C.; US
DOWNING, Marianne, M.; US
WHITE, James, M.; US
FLINDERS, Matthew; US
BLAU, David, E.; US
Priority Data:
15/415,36725.01.2017US
Title (EN) INTERCONNECT STRUCTURE FOR ELECTRICAL CONNECTING A PAIR OF MICROWAVE TRANSMISSION LINES FORMED ON A PAIR OF SPACED STRUCTURE MEMBERS
(FR) STRUCTURE D'INTERCONNEXION POUR CONNECTER ÉLECTRIQUEMENT UNE PAIRE DE LIGNES DE TRANSMISSION DE MICRO-ONDES FORMÉES SUR UNE PAIRE D'ÉLÉMENTS DE STRUCTURE ESPACÉS
Abstract:
(EN) A structure having pair of structure members separated by a gap and an interconnect structure member disposed in the gap. The interconnect structure member includes: a fill-structure having opposing sides in direct contact with the opposing sides of the first structure member and the second structure member; and, an interconnecting microwave transmission line disposed on the fill-structure electrically interconnecting the microwave transmission line of the first structure member to the second member structure. An electrically conductive member is disposed over a signal line of, and electrically connected to the ground conductor the interconnecting microwave transmission.
(FR) L'invention concerne une structure pourvue d'une paire d'éléments séparés par un espace et un élément d'interconnexion disposé dans l'espace. L'élément de structure d'interconnexion comprend : une structure de remplissage pourvue de côtés opposés en contact direct avec les côtés opposés du premier élément et du second élément de structure; et, une ligne de transmission de micro-ondes d'interconnexion disposée sur la structure de remplissage interconnectant électriquement la ligne de transmission de micro-ondes du premier élément au second élément de structure. Un élément électroconducteur est disposé sur une ligne de signal de la transmission de micro-ondes d'interconnexion et est électriquement connecté au conducteur de masse.
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: English (EN)
Filing Language: English (EN)