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1. (WO2018139822) SEMICONDUCTOR DONOR SUBSTRATE, METHOD FOR MANUFACTURING SEMICONDUCTOR DONOR SUBSTRATE, METHOD FOR MANUFACTURING ORGANIC LIGHT EMITTING DEVICE, AND DONOR SUBSTRATE MODULE

Pub. No.:    WO/2018/139822    International Application No.:    PCT/KR2018/000974
Publication Date: Fri Aug 03 01:59:59 CEST 2018 International Filing Date: Wed Jan 24 00:59:59 CET 2018
IPC: H01L 51/00
H01L 51/56
C23C 14/12
C23C 14/22
B05D 1/00
C23C 14/04
C23C 14/24
Applicants: DAWONSYS CO., LTD.
주식회사 다원시스
Inventors: PARK, Sun Soon
박선순
LEE, Hae Ryong
이해룡
JEE, Sung Hoon
지성훈
HONG, Won Eui
홍원의
Title: SEMICONDUCTOR DONOR SUBSTRATE, METHOD FOR MANUFACTURING SEMICONDUCTOR DONOR SUBSTRATE, METHOD FOR MANUFACTURING ORGANIC LIGHT EMITTING DEVICE, AND DONOR SUBSTRATE MODULE
Abstract:
The present invention relates to a semiconductor donor substrate that enables deposition of an organic material on a target substrate by Joule heating, the semiconductor donor substrate comprising: a body made of a semiconductor material; grooves formed on a surface portion of the body so as to accommodate an organic material for an organic light emitting device; and a heating region formed in at least a part of the grooves so that the organic material can be deposited on a target substrate by heating the organic material accommodated in the grooves.