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1. (WO2018139724) DETERGENT COMPOSITION FOR WAFER DICING
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Pub. No.: WO/2018/139724 International Application No.: PCT/KR2017/008794
Publication Date: 02.08.2018 International Filing Date: 11.08.2017
IPC:
C11D 11/00 (2006.01) ,C11D 3/20 (2006.01) ,C11D 1/66 (2006.01)
C CHEMISTRY; METALLURGY
11
ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
D
DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
11
Special methods for preparing compositions containing mixtures of detergents
C CHEMISTRY; METALLURGY
11
ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
D
DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
3
Other compounding ingredients of detergent compositions covered in group C11D1/101
16
Organic compounds
20
containing oxygen
C CHEMISTRY; METALLURGY
11
ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
D
DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
1
Detergent compositions based essentially on surface-active compounds; Use of these compounds as a detergent
66
Non-ionic compounds
Applicants:
(주)엠티아이 MTI CO.,LTD [KR/KR]; 경기도 안산시 단원구 목내로 122번길 39 (목내동) 39 (Mongnae-dong), Mongnae-ro 122beon-gil, Danwon-gu, Ansan-si, Gyeonggi-do 15598, KR
Inventors:
박성균 PARK, Sung Kyun; KR
이진규 LEE, Jin Kyu; KR
Agent:
특허법인 가산 KASAN IP & LAW FIRM; 서울시 서초구 남부순환로 2423 한원빌딩 7층 7th Floor, Hanwon Building, 2423 Nambusunhwan-ro, Seocho-gu, Seoul 06719, KR
Priority Data:
10-2017-001236626.01.2017KR
Title (EN) DETERGENT COMPOSITION FOR WAFER DICING
(FR) COMPOSITION DÉTERGENTE DESTINÉE AU DÉCOUPAGE EN DÉS DE TRANCHES
(KO) 웨이퍼 다이싱용 세정제 조성물
Abstract:
(EN) The present invention relates to a detergent composition for wafer dicing, the detergent composition comprising a propylene oxide/ethylene oxide/propylene oxide copolymer represented by chemical formula 1 below. [chemical formula 1]: R1-(PO)x(EO)y(PO)z-R2. In chemical formula 1, R1 is C8~20, R2 is -OH or C8~20, x is 1-20, y is 5-20, and z is 1-20. The detergent composition for wafer dicing according to the present invention has effects of: enhancing fine particle-removing ability of a detergent, which is used for wafer dicing; mitigating thermal damage to a wafer; and improving resistance to microorganisms.
(FR) La présente invention concerne une composition détergente destinée au découpage en dés de tranches, la composition détergente comprenant un copolymère oxyde de propylène/oxyde d'éthylène/oxyde de propylène représenté par la formule chimique 1 ci-dessous. [Formule chimique 1] : R1-(PO)x(EO)y(PO)z-R2. Dans la formule chimique 1, R1 est C8~20, R2 est -OH ou C8~20, x est 1-20, y est 5-20 et z est 1-20. Selon la présente invention, la composition détergente destinée au découpage en dés de tranches a pour effet : d'améliorer la capacité d'élimination de particules fines d'un détergent, qui est utilisé pour le découpage en dés de tranches ; d'atténuer les dommages thermiques sur une tranche ; et d'améliorer la résistance à des micro-organismes.
(KO) 본 발명은 다음 화학식 1로 표시되는 프로필렌옥사이드/에틸렌옥사이드/프로필렌옥사이드 공중합체를 포함하는 웨이퍼 다이싱용 세정제 조성물.  [화학식 1] R1-(PO)x(EO)y(PO)z-R2 여기서, 상기 R1은 C8~20이고, R2는 -OH 또는 C8~20이며, x는 1~20, y는 5~20, z는 1~20이다. 본 발명에 따른 웨이퍼 다이싱용 세정제 조성물은 웨이퍼 다이싱시 사용되는 세정제의 미립자 제거성능을 향상시키는 동시에, 웨이퍼에 대한 열적 손상을 완화시키고, 미생물에 대한 내성을 향상시키는 효과가 있다.
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Korean (KO)
Filing Language: Korean (KO)