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1. (WO2018139640) RESIN MATERIAL AND LAMINATE
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Pub. No.: WO/2018/139640 International Application No.: PCT/JP2018/002717
Publication Date: 02.08.2018 International Filing Date: 29.01.2018
IPC:
C08L 101/00 (2006.01) ,B32B 27/18 (2006.01) ,C01B 21/064 (2006.01) ,C08K 3/38 (2006.01) ,C08K 7/00 (2006.01) ,H01L 23/373 (2006.01)
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
L
COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
101
Compositions of unspecified macromolecular compounds
B PERFORMING OPERATIONS; TRANSPORTING
32
LAYERED PRODUCTS
B
LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
27
Layered products essentially comprising synthetic resin
18
characterised by the use of special additives
C CHEMISTRY; METALLURGY
01
INORGANIC CHEMISTRY
B
NON-METALLIC ELEMENTS; COMPOUNDS THEREOF
21
Nitrogen; Compounds thereof
06
Binary compounds of nitrogen with metals, with silicon, or with boron
064
with boron
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
K
USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES AS COMPOUNDING INGREDIENTS
3
Use of inorganic ingredients
38
Boron-containing compounds
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
K
USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES AS COMPOUNDING INGREDIENTS
7
Use of ingredients characterised by shape
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23
Details of semiconductor or other solid state devices
34
Arrangements for cooling, heating, ventilating or temperature compensation
36
Selection of materials, or shaping, to facilitate cooling or heating, e.g. heat sinks
373
Cooling facilitated by selection of materials for the device
Applicants:
積水化学工業株式会社 SEKISUI CHEMICAL CO., LTD. [JP/JP]; 大阪府大阪市北区西天満2丁目4番4号 4-4, Nishitemma 2-chome, Kita-ku, Osaka-shi, Osaka 5308565, JP
Inventors:
川原 悠子 KAWAHARA, Yuko; JP
大鷲 圭吾 OOWASHI, Keigo; JP
足羽 剛児 ASHIBA, Kouji; JP
杉本 匡隆 SUGIMOTO, Masataka; JP
Agent:
特許業務法人 宮▲崎▼・目次特許事務所 MIYAZAKI & METSUGI; 大阪府大阪市中央区常盤町1丁目3番8号 中央大通FNビル Chuo Odori FN Bldg., 3-8, Tokiwamachi 1-chome, Chuo-ku, Osaka-shi, Osaka 5400028, JP
Priority Data:
2017-01401330.01.2017JP
Title (EN) RESIN MATERIAL AND LAMINATE
(FR) MATIÈRE ET STRATIFIÉ À BASE DE RÉSINE
(JA) 樹脂材料及び積層体
Abstract:
(EN) A resin material is provided which can effectively improve insulation properties and thermal conductivity, can further effectively suppress variation in dielectric breakdown strength and can further effectively increase adhesion. This resin material contains first inorganic particles, second inorganic particles and a binder resin. The ratio of the compressive strength at 10% compression of the first inorganic particles to the compressive strength at 10% compression of the second inorganic particles is greater than or equal to 2.5. The compressive strength at 10% compression of the second inorganic particles is less than or equal to 1.5 N/mm2, and the aspect ratio of the primary particles constituting the second inorganic particles is less than or equal to 7.
(FR) L'invention concerne une matière à base de résine qui peut efficacement améliorer les propriétés d'isolation et la conductivité thermique, qui peut en outre supprimer efficacement une variation de la résistance au claquage diélectrique et qui peut en outre augmenter efficacement l'adhérence. Ce matériau de résine contient des premières particules inorganiques, des deuxièmes particules inorganiques et une résine liante. Le rapport de la résistance à la compression à 10 % de compression des premières particules inorganiques à la résistance à la compression à 10 % de compression des deuxièmes particules inorganiques est supérieur ou égal à 2,5. La résistance à la compression à 10 % de compression des deuxièmes particules inorganiques est inférieure ou égale à 1,5 N/mm2 et le rapport d'aspect des particules primaires constituant les deuxièmes particules inorganiques est inférieur ou égal à 7.
(JA) 絶縁性と熱伝導性とを効果的に高めることができ、さらに、絶縁破壊強度のばらつきを効果的に抑制することができ、さらに、接着性を効果的に高めることができる樹脂材料を提供する。 本発明に係る樹脂材料は、第1の無機粒子と、第2の無機粒子と、バインダー樹脂とを含み、前記第1の無機粒子の10%の圧縮時における圧縮強度の前記第2の無機粒子の10%の圧縮時における圧縮強度に対する比が、2.5以上であり、前記第2の無機粒子の10%の圧縮時における圧縮強度が、1.5N/mm以下であり、前記第2の無機粒子を構成する一次粒子のアスペクト比が7以下である。
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)