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1. (WO2018139631) RESIN SEALING DEVICE AND RESIN SEALING METHOD

Pub. No.:    WO/2018/139631    International Application No.:    PCT/JP2018/002656
Publication Date: Fri Aug 03 01:59:59 CEST 2018 International Filing Date: Tue Jan 30 00:59:59 CET 2018
IPC: H01L 21/56
Applicants: SHIN-ETSU ENGINEERING CO., LTD.
信越エンジニアリング株式会社
Inventors: OHTANI Yoshikazu
大谷 義和
MORI Hiroharu
森 寛治
TAKAHASHI Hiroshi
高橋 光
Title: RESIN SEALING DEVICE AND RESIN SEALING METHOD
Abstract:
In order to accommodate various molded article type changes by merely exchanging a second molding die, the present invention is equipped with: a first molding die having a pressing section for a workpiece having a semiconductor element mounted thereon; a second molding die having a cavity to which an uncured resin is supplied and provided so as to face the workpiece mounting surface on which the semiconductor element is mounted; an openable/closable sealing chamber formed between the first molding die and the second molding die; a drive unit for moving the first molding die and/or the second molding die in a manner such that the first and second molding dies become closer relative to one another in the direction in which the dies face one another; a pressurization mechanism having a plunger for applying pressure to the uncured resin inside the cavity in the sealed chamber; and a control unit for controlling the operation of the drive unit and the plunger. Therein, the pressurization mechanism has an uncured resin overflow channel provided in the second molding die inside the sealed chamber so as to be continuous with the cavity, and a plunger provided in the second molding die so as to be capable of moving and projecting toward the overflow channel. The first molding die has a first covering section provided so as to face the cavity, a second covering section provided so as to face the overflow channel, and a third covering section provided so as to face the plunger. The first covering section, the second covering section, and the third covering section are continuously formed with one another. The control unit controls the drive unit so as to immerse the workpiece mounting surface and the semiconductor element in the uncured resin inside the cavity, by moving the first and second molding dies so as to approach one another, and while in a state where the uncured resin inside the cavity has flowed into the overflow channel in response to the immersion, causes the plunger to move and project into the overflow channel toward the third covering section.