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1. (WO2018139559) CURABLE RESIN COMPOSITION, CURED PRODUCT, ADHESIVE, BONDING FILM, COVERLAY FILM, FLEXIBLE COPPER-CLAD LAMINATE AND CIRCUIT BOARD
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Pub. No.: WO/2018/139559 International Application No.: PCT/JP2018/002368
Publication Date: 02.08.2018 International Filing Date: 26.01.2018
IPC:
C08G 73/10 (2006.01) ,B32B 15/08 (2006.01) ,C08G 59/40 (2006.01) ,C08J 5/18 (2006.01) ,C09J 7/00 (2018.01) ,C09J 135/00 (2006.01) ,C09J 163/00 (2006.01)
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
G
MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
73
Macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen or carbon, not provided for in groups C08G12/-C08G71/238
06
Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule; Polyhydrazides; Polyamide acids or similar polyimide precursors
10
Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
B PERFORMING OPERATIONS; TRANSPORTING
32
LAYERED PRODUCTS
B
LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
15
Layered products essentially comprising metal
04
comprising metal as the main or only constituent of a layer, next to another layer of a specific substance
08
of synthetic resin
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
G
MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
59
Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by reaction of epoxy polycondensates with monofunctional low-molecular-weight compounds; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
18
Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
40
characterised by the curing agents used
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
J
WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H142
5
Manufacture of articles or shaped materials containing macromolecular substances
18
Manufacture of films or sheets
C CHEMISTRY; METALLURGY
09
DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
J
ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
7
Adhesives in the form of films or foils
C CHEMISTRY; METALLURGY
09
DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
J
ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
135
Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a carboxyl radical, and containing at least another carboxyl radical in the molecule, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Adhesives based on derivatives of such polymers
C CHEMISTRY; METALLURGY
09
DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
J
ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
163
Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
Applicants: SEKISUI CHEMICAL CO., LTD.[JP/JP]; 4-4, Nishitemma 2-chome, Kita-ku, Osaka-shi, Osaka 5300047, JP
Inventors: WAKIOKA, Sayaka; JP
TAKEDA, Kohei; JP
OATARI, Yuta; JP
SHINJO, Takashi; JP
SHINDO, Masami; JP
Agent: YASUTOMI & ASSOCIATES; 5-36, Miyahara 3-chome, Yodogawa-ku, Osaka-shi, Osaka 5320003, JP
Priority Data:
2017-01355827.01.2017JP
2018-01101926.01.2018JP
2018-01102026.01.2018JP
Title (EN) CURABLE RESIN COMPOSITION, CURED PRODUCT, ADHESIVE, BONDING FILM, COVERLAY FILM, FLEXIBLE COPPER-CLAD LAMINATE AND CIRCUIT BOARD
(FR) COMPOSITION DE RÉSINE DURCISSABLE, PRODUIT DURCI, ADHÉSIF, FILM DE LIAISON, FILM DE PROTECTION, STRATIFIÉ CUIVRÉ SOUPLE, ET CARTE IMPRIMÉE
(JA) 硬化性樹脂組成物、硬化物、接着剤、接着フィルム、カバーレイフィルム、フレキシブル銅張積層板、及び、回路基板
Abstract:
(EN) One purpose of the present invention is to provide a curable resin composition which has a high glass transition temperature after curing, and which enables the achievement of a cured product that has excellent thermal decomposition resistance, bondability and long-term heat resistance. Another purpose of the present invention is to provide: a cured product of this curable resin composition; an adhesive which contains this curable resin composition; a bonding film which is obtained using this curable resin composition; a coverlay film; a flexible copper-clad laminate; and a circuit board. The present invention is a curable resin composition which contains a curable resin, an imide oligomer that has an imide skeleton in the main chain and a crosslinkable functional group at an end, while having a number average molecular weight of 4,000 or less, and a curing accelerator, and wherein: the initial adhesive power of a cured product thereof with respect to a polyimide is 3.4 N/cm or more; and the adhesive power of the cured product with respect to the polyimide after 100 hours of storage at 200°C is 0.8 times the initial adhesive power or more.
(FR) Un objet de la présente invention vise à fournir une composition de résine durcissable présentant une température élevée de transition vitreuse après durcissement, et qui permet de réaliser un produit durci présentant une excellente résistance à la composition thermique, une excellente capacité de liaison et une excellente résistance thermique à long terme. Un autre objet de la présente invention consiste à fournir : un produit durci en cette composition de résine durcissable ; un adhésif qui contient cette composition de résine durcissable ; un film de liaison qui est obtenu par utilisation de cette composition de résine durcissable ; un film de protection ; un stratifié cuivré souple ; et une carte imprimée. La présente invention concerne une composition de résine durcissable qui contient une résine durcissable, un oligomère d'imide qui présente un squelette imide dans sa chaîne principale et un groupe fonctionnel réticulable à une extrémité, tout en présentant une masse moléculaire moyenne en nombre de 4000 ou moins, et un accélérateur de durcissement, et le pouvoir adhésif initial d'un produit durci en cette composition, par rapport à un polyamide, étant de 3,4 N/cm ou plus ; et le pouvoir adhésif du produit durci, par rapport au polyimide après 100 heures de stockage à 200 °C, étant 0,8 fois le pouvoir adhésif initial, ou plus.
(JA) 本発明は、硬化後に高いガラス転移温度を有し、耐熱分解性、接着性、及び、長期耐熱性に優れる硬化物を得ることができる硬化性樹脂組成物を提供することを目的とする。また、本発明は、該硬化性樹脂組成物の硬化物、該硬化性樹脂組成物を含む接着剤、該硬化性樹脂組成物を用いてなる接着フィルム、カバーレイフィルム、フレキシブル銅張積層板、及び、回路基板を提供することを目的とする。 本発明は、硬化性樹脂と、主鎖にイミド骨格、末端に架橋性官能基を有し、数平均分子量が4000以下であるイミドオリゴマーと、硬化促進剤とを含有し、硬化物のポリイミドに対する初期接着力が3.4N/cm以上であり、かつ、200℃で100時間保管した後の硬化物のポリイミドに対する接着力が前記初期接着力に対して0.8倍以上である硬化性樹脂組成物である。
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)