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1. (WO2018139280) CAMERA MODULE, METHOD FOR MANUFACTURING SAME, AND ELECTRONIC DEVICE
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Pub. No.: WO/2018/139280 International Application No.: PCT/JP2018/001089
Publication Date: 02.08.2018 International Filing Date: 17.01.2018
IPC:
G02B 7/02 (2006.01) ,G02B 3/14 (2006.01) ,G02B 13/00 (2006.01) ,G03B 11/00 (2006.01) ,H04N 5/225 (2006.01)
G PHYSICS
02
OPTICS
B
OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS
7
Mountings, adjusting means, or light-tight connections, for optical elements
02
for lenses
G PHYSICS
02
OPTICS
B
OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS
3
Simple or compound lenses
12
Fluid-filled or evacuated lenses
14
of variable focal length
G PHYSICS
02
OPTICS
B
OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS
13
Optical objectives specially designed for the purposes specified below
G PHYSICS
03
PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
B
APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
11
Filters or other obturators specially adapted for photographic purposes
H ELECTRICITY
04
ELECTRIC COMMUNICATION TECHNIQUE
N
PICTORIAL COMMUNICATION, e.g. TELEVISION
5
Details of television systems
222
Studio circuitry; Studio devices; Studio equipment
225
Television cameras
Applicants:
ソニーセミコンダクタソリューションズ株式会社 SONY SEMICONDUCTOR SOLUTIONS CORPORATION [JP/JP]; 神奈川県厚木市旭町四丁目14番1号 4-14-1, Asahi-cho, Atsugi-shi, Kanagawa 2430014, JP
Inventors:
小笠原 隆行 OGASAHARA Takayuki; JP
Agent:
西川 孝 NISHIKAWA Takashi; JP
稲本 義雄 INAMOTO Yoshio; JP
Priority Data:
2017-01431330.01.2017JP
Title (EN) CAMERA MODULE, METHOD FOR MANUFACTURING SAME, AND ELECTRONIC DEVICE
(FR) MODULE DE CAMÉRA, PROCÉDÉ DE FABRICATION DE CELUI-CI ET DISPOSITIF ÉLECTRONIQUE
(JA) カメラモジュールおよびその製造方法、並びに電子機器
Abstract:
(EN) The present technology relates to a camera module, a manufacturing method for the same, and an electronic device such that occurrences of ghosting and flaring can be suppressed. The camera module is provided with an image sensor, a lens unit provided on a light receiving surface of the image sensor, and at least one refractive index adjusting layer formed between the image sensor and the lens unit. This technology is applicable to, for example, a camera module provided with a CMOS image sensor.
(FR) La présente invention concerne un module de caméra, un procédé de fabrication de celui-ci, et un dispositif électronique de telle sorte que l'apparition d'image phantom et l'occurrence d'évasement peuvent être supprimées. Le module de caméra est pourvu d'un capteur d'image, d'une unité de lentille disposée sur une surface de réception de lumière du capteur d'image, et au moins une couche de réglage d'indice de réfraction formée entre le capteur d'image et l'unité de lentille. Cette technologie est applicable, par exemple, à un module de caméra pourvu d'un capteur d'image CMOS.
(JA) 本技術は、ゴーストやフレアの発生を抑えることができるようにするカメラモジュールおよびその製造方法、並びに電子機器に関する。 カメラモジュールは、イメージセンサと、イメージセンサの受光面上に設けられるレンズユニットと、イメージセンサとレンズユニットとの間に形成された少なくとも1の屈折率調整層とを備える。本技術は、例えばCMOSイメージセンサを備えるカメラモジュールに適用することができる。
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)