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|1. (WO2018139278) IMAGE-CAPTURE ELEMENT, MANUFACTURING METHOD, AND ELECTRONIC DEVICE|
|Applicants:||SONY SEMICONDUCTOR SOLUTIONS CORPORATION
|Title:||IMAGE-CAPTURE ELEMENT, MANUFACTURING METHOD, AND ELECTRONIC DEVICE|
The present disclosure relates to an image-capture element, a manufacturing method, and an electronic device for capturing higher quality images. The image-capture element is provided with: a first light absorption film which is formed, in an effective pixel peripheral area surrounding an outer side of an effective pixel area in which a plurality of pixels are arranged in a matrix, so as to cover a semiconductor substrate; a microlens layer which is disposed over the first light absorption film, and in which a microlens for collecting light for each pixel in the effective pixel area is formed; and a second light absorption film which is disposed over the microlens layer and which is formed in the effective pixel peripheral area. The present technology may be applied in a CMOS image sensor, for example.