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1. (WO2018139278) IMAGE-CAPTURE ELEMENT, MANUFACTURING METHOD, AND ELECTRONIC DEVICE

Pub. No.:    WO/2018/139278    International Application No.:    PCT/JP2018/001087
Publication Date: Fri Aug 03 01:59:59 CEST 2018 International Filing Date: Thu Jan 18 00:59:59 CET 2018
IPC: H01L 27/146
G02B 1/11
G02B 3/00
G02B 5/20
G02B 5/22
H04N 5/357
H04N 5/369
H04N 9/07
Applicants: SONY SEMICONDUCTOR SOLUTIONS CORPORATION
ソニーセミコンダクタソリューションズ株式会社
Inventors: OOTSUKA Yoichi
大塚 洋一
Title: IMAGE-CAPTURE ELEMENT, MANUFACTURING METHOD, AND ELECTRONIC DEVICE
Abstract:
The present disclosure relates to an image-capture element, a manufacturing method, and an electronic device for capturing higher quality images. The image-capture element is provided with: a first light absorption film which is formed, in an effective pixel peripheral area surrounding an outer side of an effective pixel area in which a plurality of pixels are arranged in a matrix, so as to cover a semiconductor substrate; a microlens layer which is disposed over the first light absorption film, and in which a microlens for collecting light for each pixel in the effective pixel area is formed; and a second light absorption film which is disposed over the microlens layer and which is formed in the effective pixel peripheral area. The present technology may be applied in a CMOS image sensor, for example.