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1. (WO2018139240) THERMALLY CONDUCTIVE SHEET
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Pub. No.: WO/2018/139240 International Application No.: PCT/JP2018/000891
Publication Date: 02.08.2018 International Filing Date: 16.01.2018
IPC:
H01L 23/373 (2006.01) ,B32B 7/02 (2006.01) ,B32B 27/00 (2006.01) ,B32B 27/18 (2006.01) ,C08J 7/04 (2006.01) ,H05K 7/20 (2006.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23
Details of semiconductor or other solid state devices
34
Arrangements for cooling, heating, ventilating or temperature compensation
36
Selection of materials, or shaping, to facilitate cooling or heating, e.g. heat sinks
373
Cooling facilitated by selection of materials for the device
B PERFORMING OPERATIONS; TRANSPORTING
32
LAYERED PRODUCTS
B
LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
7
Layered products characterised by the relation between layers, i.e. products essentially comprising layers having different physical properties or products characterised by the interconnection of layers
02
in respect of physical properties, e.g. hardness
B PERFORMING OPERATIONS; TRANSPORTING
32
LAYERED PRODUCTS
B
LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
27
Layered products essentially comprising synthetic resin
B PERFORMING OPERATIONS; TRANSPORTING
32
LAYERED PRODUCTS
B
LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
27
Layered products essentially comprising synthetic resin
18
characterised by the use of special additives
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
J
WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H142
7
Chemical treatment or coating of shaped articles made of macromolecular substances
04
Coating
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
7
Constructional details common to different types of electric apparatus
20
Modifications to facilitate cooling, ventilating, or heating
Applicants:
信越化学工業株式会社 SHIN-ETSU CHEMICAL CO., LTD. [JP/JP]; 東京都千代田区大手町二丁目6番1号 6-1, Ohtemachi 2-chome, Chiyoda-ku, Tokyo 1000004, JP
Inventors:
遠藤 晃洋 ENDO Akihiro; JP
石原 靖久 ISHIHARA Yasuhisa; JP
山口 久治 YAMAGUCHI Hisaharu; JP
茂木 正弘 MOTEKI Masahiro; JP
Agent:
特許業務法人英明国際特許事務所 PATENT PROFESSIONAL CORPORATION EI-MEI PATENT OFFICE; 東京都中央区銀座二丁目16番12号 銀座大塚ビル2階 GINZA OHTSUKA Bldg. 2F, 16-12, Ginza 2-chome, Chuo-ku, Tokyo 1040061, JP
Priority Data:
2017-01176026.01.2017JP
Title (EN) THERMALLY CONDUCTIVE SHEET
(FR) FEUILLE THERMO-CONDUCTRICE
(JA) 熱伝導性シート
Abstract:
(EN) A thermally conductive sheet in which a cured layer of a thermally conductive silicone composition is laminated on one or both sides of a synthetic resin film layer of aromatic polyimide, etc. having excellent heat resistance, electrical insulation, and mechanical strength, wherein good thermal conductivity, good insulation, and strong interlayer adhesion are provided because the thermally conductive silicone composition includes 250 to 600 wt. % of an aspherical thermally conductive filler material, which contains no more than 80 ml/100 g of a DOP oil absorption amount and an organic silicon compound component including an adhesion imparting agent, relative to 100 wt. % of the organic silicon compound component, and moreover the thermally conductive sheet with no brittleness during use can be made using continuous molding.
(FR) L’invention concerne une feuille thermo-conductrice qui est telle qu’une couche de produit durci d’une composition de silicone thermo-conductrice est stratifiée sur les deux faces ou sur une seule face d’une couche de film de résine synthétique à base, par exemple, d’un polyimide aromatique remarquable en termes de résistance à la chaleur, d’isolation électrique et de résistance mécanique. Cette composition de silicone thermo-conductrice contient un composant de composé silicium organique contenant un donneur d’adhésivité, et 250 à 600 parties en masse d’un matériau de charge thermo-conducteur non-sphérique d’absorption d’huile DOP inférieure ou égale à 80ml/100g pour 100 parties en masse du composant de composé silicium organique. Ainsi, il est possible de fabriquer par moulage en continu une feuille thermo-conductrice qui présente des propriétés de thermoconduction élevées, une isolation élevée, et une forte adhésivité intercouche, et qui ne risque pas de se fragiliser lors de sa mise en œuvre.
(JA) 耐熱性、電気絶縁性および機械的強度に富む芳香族ポリイミド等の合成樹脂フィルム層の両面または片面に、熱伝導性シリコーン組成物の硬化物層を積層した熱伝導性シートにおいて、該熱伝導性シリコーン組成物が、接着性付与剤を含む有機ケイ素化合物成分およびDOP吸油量が80ml/100g以下である非球状の熱伝導性充填材を該有機ケイ素化合物成分100質量部に対して250~600質量部含むことにより、高い熱伝導性、高い絶縁性、強固な層間接着性を有し、さらに使用時の脆化が発生しない熱伝導性シートを連続成形により製造することができる。
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)