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1. WO2018139134 - ROOM TEMPERATURE-VULCANIZING SILANE-CONTAINING RESIN COMPOSITION AND MOUNTING CIRCUIT SUBSTRATE

Publication Number WO/2018/139134
Publication Date 02.08.2018
International Application No. PCT/JP2017/046082
International Filing Date 22.12.2017
IPC
C08L 15/00 2006.01
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
15Compositions of rubber derivatives
C08K 5/54 2006.01
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
KUSE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES AS COMPOUNDING INGREDIENTS
5Use of organic ingredients
54Silicon-containing compounds
C09D 115/00 2006.01
CCHEMISTRY; METALLURGY
09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
DCOATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
115Coating compositions based on rubber derivatives
H01L 23/29 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
28Encapsulation, e.g. encapsulating layers, coatings
29characterised by the material
H01L 23/31 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
28Encapsulation, e.g. encapsulating layers, coatings
31characterised by the arrangement
H05K 3/28 2006.01
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3Apparatus or processes for manufacturing printed circuits
22Secondary treatment of printed circuits
28Applying non-metallic protective coatings
CPC
C08C 19/25
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
CTREATMENT OR CHEMICAL MODIFICATION OF RUBBERS
19Chemical modification of rubber
25Incorporating silicon atoms into the molecule
C08L 15/00
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
15Compositions of rubber derivatives
C09D 115/00
CCHEMISTRY; METALLURGY
09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
DCOATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
115Coating compositions based on rubber derivatives
H01L 23/29
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
28Encapsulations, e.g. encapsulating layers, coatings, ; e.g. for protection
29characterised by the material ; , e.g. carbon
H01L 23/31
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
28Encapsulations, e.g. encapsulating layers, coatings, ; e.g. for protection
31characterised by the arrangement ; or shape
H05K 1/0326
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1Printed circuits
02Details
03Use of materials for the substrate
0313Organic insulating material
032consisting of one material
0326containing O
Applicants
  • 信越化学工業株式会社 SHIN-ETSU CHEMICAL CO., LTD. [JP]/[JP]
Inventors
  • 藤原 晃嗣 FUJIWARA Akitsugu
  • 廣神 宗直 HIROKAMI Munenao
Agents
  • 特許業務法人英明国際特許事務所 PATENT PROFESSIONAL CORPORATION EI-MEI PATENT OFFICE
Priority Data
2017-01425430.01.2017JP
Publication Language Japanese (JA)
Filing Language Japanese (JA)
Designated States
Title
(EN) ROOM TEMPERATURE-VULCANIZING SILANE-CONTAINING RESIN COMPOSITION AND MOUNTING CIRCUIT SUBSTRATE
(FR) COMPOSITION DE RÉSINE VULCANISABLE À TEMPÉRATURE AMBIANTE CONTENANT UN SILANE ET SUBSTRAT POUR CIRCUIT DE MONTAGE L'UTILISANT
(JA) 室温硬化性シラン含有樹脂組成物及び実装回路基板
Abstract
(EN)
Provided is a room temperature-vulcanizing silane-containing resin composition containing: (A) 100 parts by mass of a silane-modified polybutadiene compound represented by formula (1) (In the formula, each R1 is independently a substituted or unsubstituted monovalent hydrocarbon group having 1 to 12 carbons; each R2 is independently a substituted or unsubstituted monovalent hydrocarbon group having 1 to 12 carbons; f is a number equal to or greater than 0; e and g are numbers greater than 0; m is an integer from 1 to 3; and the sequence of the individual repeat units may be any sequence.); (B) 0.5 to 20 parts by mass of a hydrolyzable organosilane compound having in each molecule an average of at least two silicon atom-bonded hydrolyzable groups, and/or the partial hydrolysis condensate of this hydrolyzable organosilane compound; and (C) 0.1 to 10 parts by mass of a curing catalyst. This room temperature-vulcanizing silane-containing resin composition is suitable for application as a coating agent composition and in particular as, e.g., a coating agent for electrical and electronic components and substrates therefor, and a sealant for liquid crystal display elements. In particular, the room temperature-vulcanizing silane-containing resin composition provides a gas permeation-resistant coating film (cured material) and is thus useful as a coating agent that exhibits a corrosion-inhibiting capability versus corrosive gases.
(FR)
L'invention concerne une composition de résine vulcanisable à température ambiante contenant un silane qui contient : (A) 100 parties en poids d'un composé de polybutadiène modifié par un silane représenté par la formule (1) (dans la formule, chaque R1 est indépendamment un groupe hydrocarbure monovalent substitué ou non ayant de 1 à 12 atomes de carbone ; chaque R2 est indépendamment un groupe hydrocarbure monovalent substitué ou non ayant de 1 à 12 atomes de carbone ; f est un nombre égal ou supérieur à 0 ; e et g sont des nombres supérieurs à 0 ; m est un nombre entier de 1 à 3 ; et la séquence de motifs répétitifs individuels peut être une séquence quelconque) ; (B) de 0,5 à 20 parties en poids d'un composé d'organosilane hydrolysable ayant dans chaque molécule une moyenne d'au moins deux groupes hydrolysables liés à un atome de silicium, et/ou le condensat d'hydrolyse partielle de ce composé d'organosilane hydrolysable ; et (C) de 0,1 à 10 parties en poids d'un catalyseur de durcissement. La composition de résine vulcanisable à température ambiante contenant un silane selon l'invention se prête à une application à titre de composition d'agent de revêtement et, en particulier, à titre d'agent de revêtement pour composants électriques et électroniques et leurs substrats, et d'agent d'étanchéité pour éléments d'affichage à cristaux liquides. En particulier, la composition de résine vulcanisable à température ambiante contenant un silane forme un film de revêtement résistant à la perméation de gaz (matériau durci) et est ainsi utile à titre d'agent de revêtement qui fait preuve d'une capacité d'inhibition de la corrosion vis-à-vis des gaz corrosifs.
(JA)
(A)下式(1)(式中、R1は独立に炭素数1~12の非置換又は置換の一価炭化水素基、R2は独立に炭素数1~12の非置換又は置換の一価炭化水素基、fは0以上の数、e、gは0より大きい数、mは1~3の整数である。ただし、各繰り返し単位の順序は任意である。) で表されるシラン変性ポリブタジエン化合物:100質量部、 (B)ケイ素原子に結合した加水分解性基を1分子中に平均2個以上有する加水分解性オルガノシラン化合物及び/又はその部分加水分解縮合物:0.5~20質量部、 (C)硬化触媒:0.1~10質量部 を含有する室温硬化性シラン含有樹脂組成物は、コーティング剤組成物としての用途、特に電気・電子部品及びその基板のコーティング剤、液晶表示素子用シール剤等として好適であり、特に、耐ガス透過性のコーティング被膜(硬化物)が得られることから、腐食性ガスに対する腐食防止性能を有するコーティング剤として有用である。
Also published as
EP2017893988
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