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1. (WO2018139125) SUBSTRATE PROTECTION FILM, ANTI-ADHESION MEMBER, AND METHOD FOR FORMING ANTI-ADHESION MEMBER

Pub. No.:    WO/2018/139125    International Application No.:    PCT/JP2017/045923
Publication Date: Fri Aug 03 01:59:59 CEST 2018 International Filing Date: Fri Dec 22 00:59:59 CET 2017
IPC: C03C 17/42
B08B 17/02
B32B 7/02
B32B 9/00
C03C 17/38
Applicants: SEIWA ELECTRIC MFG. CO., LTD.
星和電機株式会社
Inventors: OGATA Shiro
緒方 四郎
SUDA Shuhei
須田 修平
TAKAMIYA Shota
高宮 祥太
Title: SUBSTRATE PROTECTION FILM, ANTI-ADHESION MEMBER, AND METHOD FOR FORMING ANTI-ADHESION MEMBER
Abstract:
[Problem] To provide a substrate protection film which can reduce the adhesion of a substance onto the surface of a substrate more effectively than a substance adhesion reduction effect achieved by an electrostatic repulsion force. [Solution] A first layer (a charge retention layer 3) containing a charged substance and having an electrostatic repulsion force is formed on the surface of a substrate 1, and then a second layer (a functional group layer 4 that comprises a functional group having a functional group length of less than 1 nm and having a surface free energy of as low as 50 mJ/m2 or less) for controlling a surface free energy is formed on the surface of the first layer. When the substrate protection film 2 is formed in this manner, it becomes possible to reduce the adhesion of a substance which is caused by an intermolecular force while retaining the electrostatic repulsion force on the surface of the substrate 1, and therefore it becomes possible to reduce the adhesion of a substance onto the surface of the substrate 1 more effectively than a substance adhesion reduction effect achieved by an electrostatic repulsion force.