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1. (WO2018138961) CERAMIC CIRCUIT SUBSTRATE, POWER MODULE, AND LIGHT EMISSION DEVICE
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Pub. No.: WO/2018/138961 International Application No.: PCT/JP2017/033853
Publication Date: 02.08.2018 International Filing Date: 20.09.2017
IPC:
H01L 23/28 (2006.01) ,H01L 23/12 (2006.01) ,H01L 33/62 (2010.01) ,H01S 5/022 (2006.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23
Details of semiconductor or other solid state devices
28
Encapsulation, e.g. encapsulating layers, coatings
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23
Details of semiconductor or other solid state devices
12
Mountings, e.g. non-detachable insulating substrates
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
33
Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
48
characterised by the semiconductor body packages
62
Arrangements for conducting electric current to or from the semiconductor body, e.g. leadframe, wire-bond or solder balls
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
S
DEVICES USING STIMULATED EMISSION
5
Semiconductor lasers
02
Structural details or components not essential to laser action
022
Mountings; Housings
Applicants:
京セラ株式会社 KYOCERA CORPORATION [JP/JP]; 京都府京都市伏見区竹田鳥羽殿町6番地 6, Takeda Tobadono-cho, Fushimi-ku, Kyoto-shi, Kyoto 6128501, JP
Inventors:
本多 輝行 HONDA, Teruyuki; JP
細井 義博 HOSOI, Yoshihiro; JP
Agent:
西教 圭一郎 SAIKYO, Keiichiro; JP
Priority Data:
2017-01352827.01.2017JP
Title (EN) CERAMIC CIRCUIT SUBSTRATE, POWER MODULE, AND LIGHT EMISSION DEVICE
(FR) SUBSTRAT DE CIRCUIT CÉRAMIQUE, MODULE DE PUISSANCE, ET DISPOSITIF D'ÉMISSION DE LUMIÈRE
(JA) セラミック回路基板、パワーモジュールおよび発光装置
Abstract:
(EN) The present invention pertains to a ceramic circuit substrate in which the strength of bonding with a sealing resin is enhanced, and a power module and a light emission device with which it is possible to achieve a high degree of reliability. The ceramic circuit substrate 1 is provided with a ceramic substrate 2, a conductor layer 3 made of Cu, and a metal coating 4 coating the conductor layer 3. The metal coating 4 is made of a material having, as the main component, one or more elements selected from the group consisting of Ir, Rh, Pd, Pt, Al, Ti, W, Ta, and Nb.
(FR) La présente invention concerne un substrat de circuit céramique dans lequel la force de liaison avec une résine de scellage est améliorée, ainsi qu'un module de puissance et un dispositif d'émission de lumière au moyen desquels il est possible d'obtenir un degré élevé de fiabilité. Le substrat de circuit céramique 1 comprend un substrat en céramique 2, une couche conductrice 3 faite de Cu, et un revêtement métallique 4 recouvrant la couche conductrice 3. Le revêtement métallique 4 est fait d'un matériau ayant, comme constituant principal, un ou plusieurs éléments choisis dans le groupe constitué par Ir, Rh, Pd, Pt, Al, Ti, W, Ta et Nb.
(JA) 本発明は、封止樹脂との接合強度が向上するセラミック回路基板ならびに高い信頼性を実現できるパワーモジュールおよび発光装置に関する。セラミック回路基板1は、セラミック基板2と、Cuからなる導体層3と、導体層3を被覆する金属皮膜4と、を備えている。金属皮膜4は、Ir、Rh、Pd、Pt、Al、Ti、W、TaおよびNbからなる群から選ばれる1種または2種以上を主成分とする材料からなる。
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)