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1. WO2018138319 - METHOD FOR FORMING AN ORGANIC ELECTROLUMINESCENCE (EL) ELEMENT

Publication Number WO/2018/138319
Publication Date 02.08.2018
International Application No. PCT/EP2018/052099
International Filing Date 29.01.2018
IPC
H01L 51/56 2006.1
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
51Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof
50specially adapted for light emission, e.g. organic light emitting diodes (OLED) or polymer light emitting devices (PLED)
56Processes or apparatus specially adapted for the manufacture or treatment of such devices or of parts thereof
H01L 27/32 2006.1
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
27Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
28including components using organic materials as the active part, or using a combination of organic materials with other materials as the active part
32with components specially adapted for light emission, e.g. flat-panel displays using organic light-emitting diodes
CPC
H01L 2251/556
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2251Indexing scheme relating to organic semiconductor devices covered by group H01L51/00
50Organic light emitting devices
55characterised by parameters
556Temperature
H01L 27/3211
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
27Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
28including components using organic materials as the active part, or using a combination of organic materials with other materials as the active part
32with components specially adapted for light emission, e.g. flat-panel displays using organic light-emitting diodes [OLED]
3206Multi-colour light emission
3211using RGB sub-pixels
H01L 51/0005
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
51Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof
0001Processes specially adapted for the manufacture or treatment of devices or of parts thereof
0002Deposition of organic semiconductor materials on a substrate
0003using liquid deposition, e.g. spin coating
0004using printing techniques, e.g. ink-jet printing, screen printing
0005ink-jet printing
H01L 51/001
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
51Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof
0001Processes specially adapted for the manufacture or treatment of devices or of parts thereof
0002Deposition of organic semiconductor materials on a substrate
0008using physical deposition, e.g. sublimation, sputtering
001Vacuum deposition
H01L 51/0026
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
51Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof
0001Processes specially adapted for the manufacture or treatment of devices or of parts thereof
0026Thermal treatment of the active layer, e.g. annealing
H01L 51/5012
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
51Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof
50specially adapted for light emission, e.g. organic light emitting diodes [OLED] or polymer light emitting devices [PLED]
5012Electroluminescent [EL] layer
Applicants
  • MERCK PATENT GMBH [DE]/[DE]
Inventors
  • TSENG, Hsin-Rong
  • SCHENK, Thorsten
  • LEVERMORE, Peter
  • JATSCH, Anja
Priority Data
17153718.630.01.2017EP
Publication Language English (en)
Filing Language English (EN)
Designated States
Title
(EN) METHOD FOR FORMING AN ORGANIC ELECTROLUMINESCENCE (EL) ELEMENT
(FR) PROCÉDÉ DE FORMATION D'UN ÉLÉMENT À ÉLECTROLUMINESCENCE (EL) ORGANIQUE
Abstract
(EN) The present invention relates to a method for forming an organic EL element having at least one pixel type comprising at least three different layers including a hole injection layer (HIL), a hole transport layer (HTL) and an emission layer (EML), characterized in that the HIL, the HTL and the EML of at least one pixel type are obtained by depositing inks wherein the layers are annealed after said depositing steps in a first, second and third annealing step and the difference of the annealing temperature of the first and of the second annealing step is below 35°C, preferably below 30°C, more preferably below 25°C and the annealing temperature of the third annealing step is no more than 5°C above the annealing temperature of the first and/or the second annealing step, preferably the annealing temperature of the third annealing step is equal to or below the annealing temperature of the first and the second annealing step, wherein the first annealing step is performed before the second annealing step and the second annealing step is performed before the third annealing step.
(FR) La présente invention concerne un procédé de formation d'un élément EL organique doté d'au moins un type de pixel, comportant au moins trois couches différentes comprenant une couche d'injection de trous (HIL), une couche de transport de trous (HTL) et une couche d'émission (EML), caractérisé en ce que la HIL, la HTL et l'EML d'au moins un type de pixel sont obtenues en déposant des encres, les couches étant recuites après lesdites étapes de dépôt lors d'une première, d'une deuxième et d'une troisième étape de recuit et la différence de la température de recuit de la première et de la deuxième étape de recuit étant inférieure à 35°C, de préférence inférieure à 30°C, idéalement inférieure à 25°C et la température de recuit de la troisième étape de recuit ne dépassant pas de plus de 5°C la température de recuit de la première et/ou de la deuxième étape de recuit, la température de recuit de la troisième étape de recuit étant de préférence inférieure ou égale à la température de recuit de la première et de la deuxième étape de recuit, la première étape de recuit étant effectuée avant la deuxième étape de recuit et la deuxième étape de recuit étant effectuée avant la troisième étape de recuit.
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