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|1. (WO2018137297) METHOD FOR MACHINING BLIND HOLE FOR COMPOSITE PLATE, COMPOSITE PLATE, AND HOUSING|
|Applicants:||HUAWEI TECHNOLOGIES CO., LTD.
|Title:||METHOD FOR MACHINING BLIND HOLE FOR COMPOSITE PLATE, COMPOSITE PLATE, AND HOUSING|
Disclosed is a method for machining a blind hole for a composite plate. The composite plate comprises a first substrate (10) and a second substrate (12). The method comprises: punching the first substrate (10) to form a through hole (11); and bonding the first substrate (10) with the formed through hole (11) and the second substrate (12) together to form a composite plate with a blind hole. The method can realize quick blind hole machining, and at the same time, can reduce the subsequent amount of work during machining and cutting for a numerically-controlled machine tool, thus being able to meet the requirements of high efficiency and low costs for mass production.