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1. (WO2018137297) METHOD FOR MACHINING BLIND HOLE FOR COMPOSITE PLATE, COMPOSITE PLATE, AND HOUSING

Pub. No.:    WO/2018/137297    International Application No.:    PCT/CN2017/084946
Publication Date: Fri Aug 03 01:59:59 CEST 2018 International Filing Date: Fri May 19 01:59:59 CEST 2017
IPC: B32B 15/01
Applicants: HUAWEI TECHNOLOGIES CO., LTD.
华为技术有限公司
Inventors: LUO, Jianhong
罗建红
GUO, Wenping
郭文平
GUO, Yang
郭阳
XUE, Kangle
薛康乐
Title: METHOD FOR MACHINING BLIND HOLE FOR COMPOSITE PLATE, COMPOSITE PLATE, AND HOUSING
Abstract:
Disclosed is a method for machining a blind hole for a composite plate. The composite plate comprises a first substrate (10) and a second substrate (12). The method comprises: punching the first substrate (10) to form a through hole (11); and bonding the first substrate (10) with the formed through hole (11) and the second substrate (12) together to form a composite plate with a blind hole. The method can realize quick blind hole machining, and at the same time, can reduce the subsequent amount of work during machining and cutting for a numerically-controlled machine tool, thus being able to meet the requirements of high efficiency and low costs for mass production.