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1. (WO2018136645) FLEXIBLE SUPPORT SUBSTRATE FOR TRANSFER OF SEMICONDUCTOR DEVICES
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Pub. No.: WO/2018/136645 International Application No.: PCT/US2018/014256
Publication Date: 26.07.2018 International Filing Date: 18.01.2018
IPC:
H01L 21/687 (2006.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21
Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67
Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
683
for supporting or gripping
687
using mechanical means, e.g. chucks, clamps or pinches
Applicants:
ROHINNI, LLC [US/US]; 2139 N. Main Street Coeur d' Alene, ID 83814, US
Inventors:
HUSKA, Andrew; US
PETERSON, Cody; US
ADAMS, Clinton; US
KUPCOW, Sean; US
Agent:
ALLEN, Richard, L.; US
LEE, Lewis, C.; US
Priority Data:
15/409,40918.01.2017US
Title (EN) FLEXIBLE SUPPORT SUBSTRATE FOR TRANSFER OF SEMICONDUCTOR DEVICES
(FR) SUBSTRAT DE SUPPORT FLEXIBLE POUR LE TRANSFERT DE DISPOSITIFS À SEMICONDUCTEUR
Abstract:
(EN) An apparatus for transferring a semiconductor die from a wafer tape to a product substrate. The apparatus includes a wafer frame configured to hold the wafer tape and a support frame disposed adjacent to the wafer frame. A flexible support substrate is secured in the support frame and is configured to support the product substrate. The apparatus further includes an actuator configured to position the semiconductor die at a transfer position with respect to the product substrate. An energy-emitting device is configured to direct energy through the flexible support substrate to a portion of the product substrate corresponding to the transfer position at which the semiconductor die is positioned to be affixed to the product substrate.
(FR) L'invention concerne un appareil pour transférer une puce semiconductrice d'une bande de tranche à un substrat de produit. L'appareil comprend un cadre de tranche configuré pour maintenir la bande de tranche et un cadre de support disposé de manière adjacente au cadre de tranche. Un substrat de support flexible est fixé dans le cadre de support et est configuré pour supporter le substrat de produit. L'appareil comprend en outre un actionneur configuré pour positionner la puce semiconductrice dans une position de transfert par rapport au substrat de produit. Un dispositif d'émission d'énergie est configuré pour diriger de l'énergie à travers le substrat de support flexible vers une partie du substrat de produit correspondant à la position de transfert au niveau de laquelle la puce semiconductrice est positionnée pour être fixée au substrat de produit.
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: English (EN)
Filing Language: English (EN)