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1. (WO2018136428) CONDUCTIVE STRESS-RELIEF WASHERS IN MICROELECTRONIC ASSEMBLIES

Pub. No.:    WO/2018/136428    International Application No.:    PCT/US2018/013899
Publication Date: Fri Jul 27 01:59:59 CEST 2018 International Filing Date: Wed Jan 17 00:59:59 CET 2018
IPC: H05K 1/18
H05K 1/02
Applicants: INTEL CORPORATION
Inventors: KIM, Hyoung Il
Title: CONDUCTIVE STRESS-RELIEF WASHERS IN MICROELECTRONIC ASSEMBLIES
Abstract:
Microelectronic device assembly including a component attached to substrate by at least a screw. The screw applies compressive force against a pad of a thermally and electrically conductive material having sufficiently low modulus to mitigate stress in addition to providing a thermal and electrical path between the component and the substrate. In some embodiments, the screw affixes a printed circuit board hosting one or more integrated circuit components to a motherboard, or passive heat sink. The pad may be deformed to assuage stress applied through the screw during assembly of the device and/or as the device experiences thermal cycling, for example associated with intermittent operation.