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|1. (WO2018135708) METHOD FOR PRODUCING SEMICONDUCTOR PACKAGE|
|Applicants:||NEPES CO., LTD.
|Inventors:||KIM, Nam Chul
YEO, Yong Woon
KWON, Yong Tae
LEE, Young Seok
|Title:||METHOD FOR PRODUCING SEMICONDUCTOR PACKAGE|
Provided is a method for producing a semiconductor package comprising a step for forming an interconnected structure, the method according to the technical concept of the present invention comprising the steps of: arranging a plurality of wafers on a tray; forming the interconnected structure on top of the tray and plurality of wafers; and separating the plurality of wafers from the tray.