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1. (WO2018135708) METHOD FOR PRODUCING SEMICONDUCTOR PACKAGE

Pub. No.:    WO/2018/135708    International Application No.:    PCT/KR2017/004830
Publication Date: Fri Jul 27 01:59:59 CEST 2018 International Filing Date: Thu May 11 01:59:59 CEST 2017
IPC: H01L 21/673
H01L 23/04
H01L 23/522
Applicants: NEPES CO., LTD.
주식회사 네패스
Inventors: KIM, Nam Chul
김남철
YEO, Yong Woon
여용운
KWON, Yong Tae
권용태
LEE, Young Seok
이영석
Title: METHOD FOR PRODUCING SEMICONDUCTOR PACKAGE
Abstract:
Provided is a method for producing a semiconductor package comprising a step for forming an interconnected structure, the method according to the technical concept of the present invention comprising the steps of: arranging a plurality of wafers on a tray; forming the interconnected structure on top of the tray and plurality of wafers; and separating the plurality of wafers from the tray.