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1. WO2018135327 - LIQUID IMMERSION COOLING DEVICE, LIQUID IMMERSION COOLING SYSTEM, AND ELECTRONIC DEVICE COOLING METHOD

Publication Number WO/2018/135327
Publication Date 26.07.2018
International Application No. PCT/JP2018/000121
International Filing Date 05.01.2018
IPC
H05K 7/20 2006.01
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
7Constructional details common to different types of electric apparatus
20Modifications to facilitate cooling, ventilating, or heating
G06F 1/20 2006.01
GPHYSICS
06COMPUTING; CALCULATING OR COUNTING
FELECTRIC DIGITAL DATA PROCESSING
1Details not covered by groups G06F3/-G06F13/82
16Constructional details or arrangements
20Cooling means
H01L 23/44 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
34Arrangements for cooling, heating, ventilating or temperature compensation
44the complete device being wholly immersed in a fluid other than air
H05K 7/18 2006.01
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
7Constructional details common to different types of electric apparatus
18Construction of rack or frame
CPC
G06F 1/20
GPHYSICS
06COMPUTING; CALCULATING; COUNTING
FELECTRIC DIGITAL DATA PROCESSING
1Details not covered by groups G06F3/00G06F13/00 and G06F21/00
16Constructional details or arrangements
20Cooling means
G06F 2200/201
GPHYSICS
06COMPUTING; CALCULATING; COUNTING
FELECTRIC DIGITAL DATA PROCESSING
2200Indexing scheme relating to G06F1/04 - G06F1/32
20Indexing scheme relating to G06F1/20
201Cooling arrangements using cooling fluid
H01L 23/041
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
02Containers; Seals
04characterised by the shape ; of the container or parts, e.g. caps, walls
041the container being a hollow construction having no base used as a mounting for the semiconductor body
H01L 23/10
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
02Containers; Seals
10characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
H01L 23/427
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
34Arrangements for cooling, heating, ventilating or temperature compensation ; ; Temperature sensing arrangements
42Fillings or auxiliary members in containers ; or encapsulations; selected or arranged to facilitate heating or cooling
427Cooling by change of state, e.g. use of heat pipes
H01L 23/44
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
34Arrangements for cooling, heating, ventilating or temperature compensation ; ; Temperature sensing arrangements
44the complete device being wholly immersed in a fluid other than air
Applicants
  • 富士通株式会社 FUJITSU LIMITED [JP]/[JP]
Inventors
  • 脇野 有希子 WAKINO, Yukiko
  • 稲野 聡 INANO, Satoshi
  • 福田 裕幸 FUKUDA, Hiroyuki
  • 石鍋 稔 ISHINABE, Minoru
Agents
  • 向山 直樹 MUKOUYAMA, Naoki
Priority Data
2017-00661318.01.2017JP
Publication Language Japanese (JA)
Filing Language Japanese (JA)
Designated States
Title
(EN) LIQUID IMMERSION COOLING DEVICE, LIQUID IMMERSION COOLING SYSTEM, AND ELECTRONIC DEVICE COOLING METHOD
(FR) DISPOSITIF DE REFROIDISSEMENT PAR IMMERSION DANS UN LIQUIDE, SYSTÈME DE REFROIDISSEMENT PAR IMMERSION DANS UN LIQUIDE ET PROCÉDÉ DE REFROIDISSEMENT DE DISPOSITIF ÉLECTRONIQUE
(JA) 液浸冷却装置、液浸冷却システム及び電子装置の冷却方法
Abstract
(EN)
[Problem] To provide a liquid immersion cooling device, a liquid immersion cooling system, and an electronic device cooling method with which a component having a large amount of heat generation and a component having a small amount of heat generation can be both sufficiently cooled using a relatively small amount of refrigerant. [Solution] A liquid immersion cooling device comprising: a housing 11 of which a part of the interior is filled with a first refrigerant 17 and in which, among a plurality of heat-generating components 12 to 16, the heat-generating components 13 to 16 other than a first heat-generating component 12 are immersed in the first refrigerant 17; a liquid-cooled jacket 18 which is disposed in contact with the first heat-generating component 12 arranged in the housing 11 and which cools the first heat-generating component 12; a cooling device 22 which dissipates the heat of a second refrigerant sent out of the liquid-cooled jacket 18 via first piping 21b to thereby cool the second refrigerant; and a first pump 23 for sending the second refrigerant cooled by the cooling device 22 to the liquid-cooled jacket 18 via second piping 21a.
(FR)
Le problème décrit par la présente invention est de fournir un dispositif de refroidissement par immersion dans un liquide, un système de refroidissement par immersion dans un liquide, et un procédé de refroidissement de dispositif électronique avec lesquels un composant ayant une grande quantité de génération de chaleur et un composant ayant une petite quantité de génération de chaleur peuvent être tous les deux suffisamment refroidis à l'aide d'une quantité relativement petite de fluide frigorigène. La solution selon l'invention porte sur un dispositif de refroidissement par immersion dans un liquide comprenant : un boîtier 11 dont une partie de l'intérieur est remplie d'un premier fluide frigorigène 17 et dans lequel, parmi une pluralité de composants thermogènes 12 à 16, les composants thermogènes 13 à 16 autres qu'un premier composant thermogène 12 sont immergés dans le premier fluide frigorigène 17; une chemise refroidie par liquide 18 qui est disposée en contact avec le premier composant thermogène 12 disposé dans le boîtier 11 et qui refroidit le premier composant thermogène 12; un dispositif de refroidissement 22 qui dissipe la chaleur d'un second fluide frigorigène envoyé hors de la chemise refroidie par liquide 18 par l'intermédiaire d'une première canalisation 21b pour refroidir ainsi le second fluide frigorigène; et une première pompe 23 pour envoyer le second fluide frigorigène refroidi par le dispositif de refroidissement 22 vers la chemise refroidie par liquide 18 par l'intermédiaire d'une seconde canalisation 21a.
(JA)
【課題】比較的少ない冷媒で発熱量が大きい部品と発熱量が小さい部品とをいずれも十分に冷却できる液浸冷却装置、液浸冷却システム及び電子装置の冷却方法を提供する。 【解決手段】第1の冷媒17で内部の一部が満たされるとともに、複数の発熱部品12~16のうち、第1の発熱部品12以外の発熱部品13~16を第1の冷媒中17に浸す筐体11と、筐体11の内部に配置された第1の発熱部品12に接して設けられ、第1の発熱部品12を冷却する液冷ジャケット18と、第1の配管21bを介して液冷ジャケット18から送出された第2の冷媒の熱を放熱することにより、第2の冷媒を冷却する冷却装置22と、冷却装置22が冷却した第2の冷媒を第2の配管21aを介して液冷ジャケット18へ送出する第1のポンプ23とを有する。
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