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1. (WO2018135255) VAPOR DEPOSITION MASK AND METHOD FOR MANUFACTURING VAPOR DEPOSITION MASK
Latest bibliographic data on file with the International Bureau    Submit observation

Pub. No.: WO/2018/135255 International Application No.: PCT/JP2017/046689
Publication Date: 26.07.2018 International Filing Date: 26.12.2017
IPC:
C23C 14/04 (2006.01) ,C23C 14/24 (2006.01) ,H01L 51/50 (2006.01) ,H05B 33/10 (2006.01) ,H05B 33/14 (2006.01)
C CHEMISTRY; METALLURGY
23
COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
C
COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
14
Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
04
Coating on selected surface areas, e.g. using masks
C CHEMISTRY; METALLURGY
23
COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
C
COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
14
Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
22
characterised by the process of coating
24
Vacuum evaporation
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
51
Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof
50
specially adapted for light emission, e.g. organic light emitting diodes (OLED) or polymer light emitting devices (PLED)
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
B
ELECTRIC HEATING; ELECTRIC LIGHTING NOT OTHERWISE PROVIDED FOR
33
Electroluminescent light sources
10
Apparatus or processes specially adapted to the manufacture of electroluminescent light sources
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
B
ELECTRIC HEATING; ELECTRIC LIGHTING NOT OTHERWISE PROVIDED FOR
33
Electroluminescent light sources
12
Light sources with substantially two-dimensional radiating surfaces
14
characterised by the chemical or physical composition or the arrangement of the electroluminescent material
Applicants: DAI NIPPON PRINTING CO., LTD.[JP/JP]; 1-1, Ichigaya-kaga-cho 1-chome, Shinjuku-ku, Tokyo 1628001, JP
Inventors: UCHIDA Yasuhiro; JP
MATSUURA Sachiyo; JP
IKENAGA Chikao; JP
Agent: NAGAI Hiroshi; JP
NAKAMURA Yukitaka; JP
SATO Yasukazu; JP
ASAKURA Satoru; JP
HOTTA Yukihiro; JP
OKAMURA Kazuro; JP
Priority Data:
2017-00599917.01.2017JP
2017-23898913.12.2017JP
Title (EN) VAPOR DEPOSITION MASK AND METHOD FOR MANUFACTURING VAPOR DEPOSITION MASK
(FR) MASQUE DE DÉPÔT EN PHASE VAPEUR ET PROCÉDÉ DE FABRICATION DE CE DERNIER
(JA) 蒸着マスク及び蒸着マスクの製造方法
Abstract:
(EN) This vapor deposition mask is provided with: a first surface and a second surface, in which a through hole is formed; a pair of long side surfaces, which are connected to the first surface and the second surface, and which define the outline of the vapor deposition mask in the longitudinal direction of the vapor deposition mask; and a pair of short side surfaces, which are connected to the first surface and the second surface, and which define the outline of the vapor deposition mask in the width direction of the vapor deposition mask. Each of the long side surfaces includes a first end section positioned on the first surface side, and a second end section, which is positioned on the second surface side, and which is positioned further toward the inner side than the first end section, said each of the long side surfaces having a first part recessed to the inner side. The through hole includes a first recessed section formed on the first surface side, and a second recessed section, which is formed on the second surface side, and which is connected, in a hole connection section, to the first recessed section. The first end section of the first part of each of the long side surfaces is positioned further toward the first surface side than the hole connection section.
(FR) L'invention concerne un masque de dépôt en phase vapeur qui comprend : une première surface et une seconde surface, dans lesquelles un trou traversant est formé ; une paire de surfaces latérales longues, qui sont reliées à la première surface et à la seconde surface, et qui définissent le contour du masque de dépôt en phase vapeur dans la direction longitudinale du masque de dépôt en phase vapeur ; et une paire de surfaces latérales courtes, qui sont reliées à la première surface et à la seconde surface, et qui définissent le contour du masque de dépôt en phase vapeur dans la direction de la largeur du masque de dépôt en phase vapeur. Chacune des surfaces latérales longues comprend une première section d'extrémité, positionnée du côté de la première surface, et une seconde section d'extrémité, positionnée du côté de la seconde surface et positionnée plus près du côté interne que la première section d'extrémité, lesdites surfaces latérales longues ayant une première partie évidée vers le côté interne. Le trou traversant comprend une première section évidée, formée sur le côté de la première surface, et une seconde section évidée, formée sur le côté de la seconde surface et reliée, dans une section de connexion de trou, à la première section évidée. La première section d'extrémité de la première partie de chacune des surfaces latérales longues est positionnée plus près du côté de la première surface que la section de connexion de trou.
(JA) 蒸着マスクは、貫通孔が形成された第1面及び第2面と、第1面及び第2面に接続され、蒸着マスクの長手方向における蒸着マスクの輪郭を画定する一対の長側面と、第1面及び第2面に接続され、蒸着マスクの幅方向における蒸着マスクの輪郭を画定する一対の短側面と、を備える。長側面は、第1面側に位置する第1端部と、第2面側に位置するとともに第1端部よりも内側に位置する第2端部とを含み、且つ内側へ凹んだ第1部分を有する。貫通孔は、第1面側に形成された第1凹部と、第2面側に形成され、孔接続部において第1凹部に接続された第2凹部と、を含む。長側面の第1部分の第1端部が、孔接続部よりも第1面側に位置する。
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)