Search International and National Patent Collections

1. (WO2018133060) FINGERPRINT CHIP PACKAGING AND PROCESSING METHOD

Pub. No.:    WO/2018/133060    International Application No.:    PCT/CN2017/072043
Publication Date: Fri Jul 27 01:59:59 CEST 2018 International Filing Date: Mon Jan 23 00:59:59 CET 2017
IPC: H01L 23/495
Applicants: SHENZHEN GOODIX TECHNOLOGY CO., LTD.
深圳市汇顶科技股份有限公司
Inventors: ZENG, Shanshan
曾珊珊
WANG, Penghui
汪鹏辉
LUO, Junping
罗军平
Title: FINGERPRINT CHIP PACKAGING AND PROCESSING METHOD
Abstract:
A fingerprint chip packaging and a processing method, related to the field of biometrics. The fingerprint chip packaging comprises: a lead frame (1), a chip (2), and a laminating element wrapping the lead frame (1) and the chip (2). The lead frame (1) comprises a die pad (13), connecting bars (11), and gold interconnects (12). The die pad (13) is used for supporting the chip (2). The connecting bars (11) are used for supporting the lead frame (1) and are connected to the die pad (13) via the gold interconnects (12). The gold interconnects (12) are used for fixing the die pad (13) and electrically connecting the chip (2). The difficulty of cutting the fingerprint chip packaging is effectively reduced, the efficiency of separating individual packaging is increased, and at the same time, the area of contact between the gold interconnects (12) at multiple sides and the die pad (13) is greater than the area of contact between connecting bars and a die pad in the prior art, thus increasing the stability of the bonding of the chip (2) and the connection of soldered wires (3); meanwhile, the connecting bars (11) at the extremity of the gold interconnects (12) electrically connected to the chip (2) are completely etched, thus allowing constituent parts within the fingerprint chip packaging to disconnect corresponding electric connections, and allowing the implementation of strip testing of the fingerprint chip packaging.