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1. (WO2018132716) APPARATUS FOR HIGH SPEED PRINTING OF SEMICONDUCTOR DEVICES

Pub. No.:    WO/2018/132716    International Application No.:    PCT/US2018/013584
Publication Date: Fri Jul 20 01:59:59 CEST 2018 International Filing Date: Sat Jan 13 00:59:59 CET 2018
IPC: H01L 21/70
G03F 7/00
Applicants: ROHINNI, LLC
Inventors: PETERSON, Cody
Title: APPARATUS FOR HIGH SPEED PRINTING OF SEMICONDUCTOR DEVICES
Abstract:
A device for depositing an unpackaged semiconductor die ("die") onto a substrate. The device includes a developing unit adjacent to a drum. The developing unit having wrapped thereon a diced semiconductor wafer including at least one die. The developing unit configured to move laterally in a direction of a longitudinal axis of the developing unit to transfer the at least one die to the drum.