Some content of this application is unavailable at the moment.
If this situation persist, please contact us atFeedback&Contact
1. (WO2018131545) CURABLE RESIN COMPOSITION, CURED PRODUCT THEREOF, AND SEMICONDUCTOR DEVICE
Latest bibliographic data on file with the International BureauSubmit observation

Pub. No.: WO/2018/131545 International Application No.: PCT/JP2018/000113
Publication Date: 19.07.2018 International Filing Date: 05.01.2018
IPC:
C08L 83/07 (2006.01) ,C08K 3/00 (2018.01) ,C08K 5/04 (2006.01) ,C08K 5/3477 (2006.01) ,C08K 5/54 (2006.01) ,C08L 63/00 (2006.01) ,C08L 83/05 (2006.01) ,H01L 23/29 (2006.01) ,H01L 23/31 (2006.01) ,H01L 33/56 (2010.01)
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
L
COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
83
Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen, or carbon only; Compositions of derivatives of such polymers
04
Polysiloxanes
07
containing silicon bound to unsaturated aliphatic groups
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
K
USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES AS COMPOUNDING INGREDIENTS
3
Use of inorganic ingredients
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
K
USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES AS COMPOUNDING INGREDIENTS
5
Use of organic ingredients
04
Oxygen-containing compounds
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
K
USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES AS COMPOUNDING INGREDIENTS
5
Use of organic ingredients
16
Nitrogen-containing compounds
34
Heterocyclic compounds having nitrogen in the ring
3467
having more than two nitrogen atoms in the ring
3477
Six-membered rings
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
K
USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES AS COMPOUNDING INGREDIENTS
5
Use of organic ingredients
54
Silicon-containing compounds
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
L
COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
63
Compositions of epoxy resins; Compositions of derivatives of epoxy resins
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
L
COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
83
Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen, or carbon only; Compositions of derivatives of such polymers
04
Polysiloxanes
05
containing silicon bound to hydrogen
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23
Details of semiconductor or other solid state devices
28
Encapsulation, e.g. encapsulating layers, coatings
29
characterised by the material
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23
Details of semiconductor or other solid state devices
28
Encapsulation, e.g. encapsulating layers, coatings
31
characterised by the arrangement
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
33
Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
48
characterised by the semiconductor body packages
52
Encapsulations
56
Materials, e.g. epoxy or silicone resin
Applicants:
株式会社ダイセル DAICEL CORPORATION [JP/JP]; 大阪府大阪市北区大深町3番1号 3-1, Ofuka-cho, Kita-ku, Osaka-shi, Osaka 5300011, JP
Inventors:
籔野真也 YABUNO, Shinya; JP
中川泰伸 NAKAGAWA, Yasunobu; JP
Agent:
特許業務法人後藤特許事務所 GOTO & CO.; 大阪府大阪市北区紅梅町2番18号 2-18, Kobai-cho, Kita-ku, Osaka-shi, Osaka 5300038, JP
Priority Data:
2017-00545416.01.2017JP
Title (EN) CURABLE RESIN COMPOSITION, CURED PRODUCT THEREOF, AND SEMICONDUCTOR DEVICE
(FR) COMPOSITION DE RÉSINE DURCISSABLE, PRODUT DURCI À BASE DE CELLE-CI ET DISPOSITIF SEMI-CONDUCTEUR
(JA) 硬化性樹脂組成物、その硬化物、及び半導体装置
Abstract:
(EN) The purpose of the present invention is to provide a curable resin composition in which an increase in hardness or a decrease in elongation caused by heat or light is suppressed and which forms a tough cured product. The present invention provides a curable resin composition that contains the following components: a polyorganosiloxane at a quantity of 0.01-90 wt% relative to the overall composition, the polyorganosiloxane represented by the average unit formula (SiO4/2)a5(R1bSiO3/2)a6(R1b2SiO2/2)a7(R1b3SiO1/2)a8 [In the formula, R1b denotes an alkyl group, an aryl group, an alkenyl group, or the like. Relative to the overall quantity of R1b, the quantity of alkyl groups is 30-98 mol%, the quantity of aryl groups is 30-98 mol%, and the quantity of alkenyl groups is 1-20 mol%. a5 > 0, a6 ≥ 0, 0.03 ≤ a7 ≤ 0.7, a8 > 0, 0.01 ≤ a5/a7 ≤ 10, and a5+a6+a7+a8 = 1.]; a polyorganosiloxane at a quantity whereby the amount of SiH groups is 0.5-2 moles relative to 1 mole of alkenyl groups bonded to silicon atoms, the polyorganosiloxane represented by the average composition R2mHnSiO[(4-m-n)/2] [In the formula, R2 denotes an alkyl group or an aryl group. At least two SiH groups are present. 0.7 ≤ m ≤ 2.1, 0.001 ≤ n ≤ 1, and 0.8 ≤ m+n ≤ 3.]; and a hydrosilylation catalyst.
(FR) L'objectif de la présente invention est de proposer une composition de résine durcissable dont l'augmentation de la dureté ou la diminution de l'allongement sous l'effet de la chaleur ou de la lumière est supprimée et qui forme un produit durci résistant. La présente invention concerne une composition de résine durcissable qui contient les composants suivants : un polyorganosiloxane à hauteur de 0,01 à 90 % en poids par rapport à la composition dans son ensemble, le polyorganosiloxane étant représenté par la formule unitaire moyenne (SiO4/2) a5(R1bSiO3/2)a6(R1b 2SiO2/2)a7(R1b 3SiO1/2)a8 [dans la formule, R1b représente un groupe alkyle, un groupe aryle, un groupe alcényle, ou similaire. Par rapport à la quantité totale de R1b, la quantité de groupes alkyle est égale à 30 à 98 % en moles, la quantité de groupes aryle à 30 à 98 % en moles et la quantité de groupes alcényle à 1 à 20 % en moles. A5 > 0, a6 ≥ 0, 0,03 ≤ a7 ≤ 0,7, a8 > 0, 0,01 ≤ a5/a7 ≤ 10 et a5 + a6 + a7 + a8 = 1] ;un polyorganosiloxane présent en quantité telle à ce que la quantité de groupes SiH est égale à 0,5 à 2 moles pour 1 mole de groupes alcényle liés aux atomes de silicium, le polyorganosiloxane étant représenté par la composition moyenne R2 mHnSiO [(4-m-n)/2] [dans la formule, R2 représente un groupe alkyle ou un groupe aryle. Au moins deux groupes SiH sont présents. 0,7 ≤ m ≤ 2,1, 0,001 ≤ n ≤ 1 et 0,8 ≤ m + n ≤ 3] ;et un catalyseur d'hydrosilylation.
(JA) 本発明は熱・光による硬度上昇や伸度低下が抑制され、強靭な硬化物を形成する硬化性樹脂組成物を提供することを目的とする。 本発明は、下記成分を含む硬化性樹脂組成物を提供する。 平均単位式:(SiO4/2a5(R1bSiO3/2a6(R1b2SiO2/2a7(R1b3SiO1/2a8 [式中、R1bはアルキル基、アリール基、アルケニル基等。R1b全量に対してアルキル基は30~98モル%、アリール基は30~98モル%、アルケニル基は1~20モル%。a5>0、a6≧0、0.03≦a7≦0.7、a8>0、0.01≦a5/a7≦10、a5+a6+a7+a8=1]で表されるポリオルガノシロキサンを組成物全量に対して0.01~90重量% 平均組成:R2mnSiO[(4-m-n)/2] [式中、R2は、アルキル基、アリール基。SiH基を少なくとも2個有する。0.7≦m≦2.1、0.001≦n≦1、0.8≦m+n≦3]で表されるポリオルガノシロキサンをケイ素原子に結合したアルケニル基1モルに対して、SiH基が0.5~2モルとなる量 ヒドロシリル化触媒
front page image
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)