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1. (WO2018131463) WIRING IMPLEMENT
Latest bibliographic data on file with the International BureauSubmit observation

Pub. No.: WO/2018/131463 International Application No.: PCT/JP2017/046617
Publication Date: 19.07.2018 International Filing Date: 26.12.2017
IPC:
H02G 3/12 (2006.01) ,H02G 3/02 (2006.01) ,H05K 7/14 (2006.01)
H ELECTRICITY
02
GENERATION, CONVERSION, OR DISTRIBUTION OF ELECTRIC POWER
G
INSTALLATION OF ELECTRIC CABLES OR LINES, OR OF COMBINED OPTICAL AND ELECTRIC CABLES OR LINES
3
Installations of electric cables or lines or protective tubing therefor in or on buildings, equivalent structures or vehicles
02
Details
08
Distribution boxes; Connection or junction boxes
12
for flush mounting
H ELECTRICITY
02
GENERATION, CONVERSION, OR DISTRIBUTION OF ELECTRIC POWER
G
INSTALLATION OF ELECTRIC CABLES OR LINES, OR OF COMBINED OPTICAL AND ELECTRIC CABLES OR LINES
3
Installations of electric cables or lines or protective tubing therefor in or on buildings, equivalent structures or vehicles
02
Details
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
7
Constructional details common to different types of electric apparatus
14
Mounting supporting structure in casing or on frame or rack
Applicants:
パナソニックIPマネジメント株式会社 PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD. [JP/JP]; 大阪府大阪市中央区城見2丁目1番61号 1-61, Shiromi 2-chome, Chuo-ku, Osaka-shi, Osaka 5406207, JP
Inventors:
王 韋力 WANG, Weili; --
綾 健太 AYA, Kenta; --
Agent:
特許業務法人北斗特許事務所 HOKUTO PATENT ATTORNEYS OFFICE; 大阪府大阪市北区梅田1‐12‐17 梅田スクエアビル9F Umeda Square Bldg., 9F., 1-12-17, Umeda, Kita-ku, Osaka-shi, Osaka 5300001, JP
Priority Data:
2017-00471013.01.2017JP
Title (EN) WIRING IMPLEMENT
(FR) INSTRUMENT DE CÂBLAGE
(JA) 配線器具
Abstract:
(EN) The present invention addresses the problem of providing a wiring implement that does not require high dimensional accuracy of a housing that houses a first substrate. This wiring implement (10) comprises a first substrate (5), a second substrate (6), a support member (4) and a housing (1). The second substrate (6) is electrically connected to the first substrate (5), and is aligned with the first substrate (5) in the insertion direction of a first external terminal (18) into a first internal terminal (8). The support member (4) is provided on the second substrate (6) side of the first substrate (5) in the insertion direction, and supports the first substrate (5). The support member (4) comprises a support part (41) and a contact part. The support part (41) supports the first substrate (5) from the second substrate (6) side in the insertion direction. The contact part contacts the housing (1) from the first substrate (5) side in the insertion direction.
(FR) La présente invention aborde le problème de la fourniture d'un instrument de câblage qui ne nécessite pas de précision dimensionnelle élevée d'un boîtier qui loge un premier substrat. Cet instrument de câblage (10) comprend un premier substrat (5), un second substrat (6), un élément de support (4) et un boîtier (1). Le second substrat (6) est électriquement connecté au premier substrat (5), et est aligné avec le premier substrat (5) dans la direction d'insertion d'une première borne externe (18) dans une première borne interne (8). L'élément de support (4) est disposé du côté du second substrat (6) du premier substrat (5) dans la direction d'insertion, et supporte le premier substrat (5). L'élément de support (4) comprend une partie de support (41) et une partie de contact. La partie de support (41) supporte le premier substrat (5) depuis le côté du second substrat (6) dans la direction d'insertion. La partie de contact entre en contact avec le boîtier (1) depuis le côté du premier substrat (5) dans la direction d'insertion.
(JA) 本発明の課題は、第1基板を収納するハウジングについて高い寸法精度を必要としない配線器具を提供することである。本発明に係る配線器具(10)は、第1基板(5)と、第2基板(6)と、支持部材(4)と、ハウジング(1)と、を備える。第2基板(6)は、第1基板(5)に電気的に接続され、第1内側端子(8)に対する第1外側端子(18)の差込方向において第1基板(5)と並べて配置される。支持部材(4)は、差込方向において第1基板(5)に対して第2基板(6)側に配置され、第1基板(5)を支持する。支持部材(4)は、支持部(41)と、接触部と、を有する。支持部(41)は、差込方向における第2基板(6)側から第1基板(5)を支持する。接触部は、差込方向における第1基板(5)側からハウジング(1)に接触する。
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)