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1. (WO2018131189) WIRING BOARD AND SOLID-STATE IMAGE PICKUP DEVICE USING SAME

Pub. No.:    WO/2018/131189    International Application No.:    PCT/JP2017/022739
Publication Date: Fri Jul 20 01:59:59 CEST 2018 International Filing Date: Wed Jun 21 01:59:59 CEST 2017
IPC: H04N 5/369
H01L 27/146
H04N 5/225
H05K 1/02
Applicants: SHARP KABUSHIKI KAISHA
シャープ株式会社
Inventors: OHARA, Yoshikazu
小原 良和
Title: WIRING BOARD AND SOLID-STATE IMAGE PICKUP DEVICE USING SAME
Abstract:
A wiring board (1) is provided with: an image pickup element (3) that is provided on one surface of a substrate (2); a reinforcing plate (4) that is provided at a position overlapping the image pickup element (3) by having the substrate (2) therebetween; and an adhesive layer (5) formed between the reinforcing plate (4) and the substrate (2) for the purpose of adhering the reinforcing plate (4) to the substrate (2). A through hole (7) reaching the adhesive layer (5) is formed in the reinforcing plate (4).