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1. (WO2018129697) SEMICONDUCTOR COMPONENT AND MANUFACTURING METHOD THEREFOR

Pub. No.:    WO/2018/129697    International Application No.:    PCT/CN2017/070990
Publication Date: Fri Jul 20 01:59:59 CEST 2018 International Filing Date: Fri Jan 13 00:59:59 CET 2017
IPC: H01L 33/36
Applicants: ENKRIS SEMICONDUCTOR, INC
苏州晶湛半导体有限公司
Inventors: ZHANG, Liyang
张丽旸
Title: SEMICONDUCTOR COMPONENT AND MANUFACTURING METHOD THEREFOR
Abstract:
A semiconductor component and a manufacturing method therefor. The semiconductor component comprises a substrate (106), a bonding metal layer (105), a reflective layer (104), a first conductive layer (101), an active layer (102), a second conductive layer (103), a first electrode (107), and a second electrode (108). The first electrode (107) extends to the first conductive layer (101) from one side of the bonding metal layer (105) distant from the substrate (106), and is connected to the bonding metal layer (105) and the first conductive layer (101). The second electrode (108) runs through the substrate (106) and the bonding metal layer (105), and is in contact with the reflective layer (104). In the semiconductor component, a structure for sharing the first conductive layer (101) is formed, so that exit light is more uniform, the light extraction rate is higher, interference among pixel units is eliminated, the light-emitting wavelength is more uniform, and a current flowing through different pixel units is more uniform.