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1. (WO2018129385) TRANSPARENT FILM ERROR CORRECTION PATTERN IN WAFER GEOMETRY SYSTEM
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Pub. No.: WO/2018/129385 International Application No.: PCT/US2018/012673
Publication Date: 12.07.2018 International Filing Date: 05.01.2018
IPC:
H01L 21/66 (2006.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21
Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
66
Testing or measuring during manufacture or treatment
Applicants:
KLA-TENCOR CORPORATION [US/US]; Legal Dept. One Technology Drive Milpitas, California 95035, US
Inventors:
LIU, Helen; US
ZENG, Andrew; US
Agent:
MCANDREWS, Kevin; US
MORRIS, Elizabeth M. N.; US
Priority Data:
15/649,25913.07.2017US
62/443,81509.01.2017US
Title (EN) TRANSPARENT FILM ERROR CORRECTION PATTERN IN WAFER GEOMETRY SYSTEM
(FR) MOTIF DE CORRECTION D'ERREUR DE FILM TRANSPARENT DANS UN SYSTÈME DE GÉOMÉTRIE DE TRANCHE
Abstract:
(EN) A system includes one or more wafer geometry measurement tools configured to obtain geometry measurements from a wafer. The system also includes one or more processors in communication with the one or more wafer geometry measurement tools. The one or more processors are configured to apply a correction model to correct the geometry measurements obtained by the one or more wafer geometry measurement tools. The correction model is configured to correct measurement errors caused by a transparent film positioned on the wafer.
(FR) Un système comprend un ou plusieurs outils de mesure de géométrie de tranche conçus pour obtenir des mesures de géométrie à partir d'une tranche. Le système comprend également un ou plusieurs processeurs en communication avec le ou les outils de mesure de géométrie de tranche. Le ou les processeurs sont conçus pour appliquer un modèle de correction afin de corriger les mesures de géométrie obtenues par le ou les outils de mesure de géométrie de tranche. Le modèle de correction est conçu pour corriger les erreurs de mesure provoquées par un film transparent positionné sur la tranche.
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: English (EN)
Filing Language: English (EN)