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1. (WO2018128909) DEVICES WITH MOUNTED COMPONENTS
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Pub. No.: WO/2018/128909 International Application No.: PCT/US2017/068844
Publication Date: 12.07.2018 International Filing Date: 29.12.2017
IPC:
G06F 1/16 (2006.01)
G PHYSICS
06
COMPUTING; CALCULATING; COUNTING
F
ELECTRIC DIGITAL DATA PROCESSING
1
Details not covered by groups G06F3/-G06F13/82
16
Constructional details or arrangements
Applicants: MICROSOFT TECHNOLOGY LICENSING, LLC[US/US]; One Microsoft Way Redmond, Washington 98052-6399, US
Inventors: HURBI, Erin Elizabeth; US
NIKKHOO, Michael; US
MARKOVSKY, Igor; US
TOLENO, Brian Joseph; US
Agent: MINHAS, Sandip S.; US
CHEN, Wei-Chen Nicholas; US
DRAKOS, Katherine J.; US
HINOJOSA, Brianna L.; US
HOLMES, Danielle J.; US
SWAIN, Cassandra T.; US
WONG, Thomas S.; US
CHOI, Daniel; US
HWANG, William C.; US
WIGHT, Stephen A.; US
CHATTERJEE, Aaron C.; US
Priority Data:
15/400,25506.01.2017US
Title (EN) DEVICES WITH MOUNTED COMPONENTS
(FR) DISPOSITIFS AYANT DES COMPOSANTS MONTÉS
Abstract:
(EN) Devices with components mounted to a surface interior often encounter problems with generated heat, which is difficult to dissipate from a tightly packed and sealed device interior. Excessive heat may also distort the surface substrate material, which may become brittle from accumulated thermal stress and/or warp in a manner that displaces the position and/or orientation of the components. Presented herein are device manufacturing techniques in view of temperature considerations. Devices may comprise a device housing of a housing material that exhibits a substantially isotropic coefficient of thermal expansion (CTE) and/or thermal conductivity in various dimensions. Devices may also comprise a housing mount for a component cluster that is mountable on the interior surface of the device housing, with electrically conductive traces integrated with the device housing that conductively interconnect the housing mount with the component cluster, optionally generated via laser-activation of a conductive additives or deposition of conductive materials.
(FR) Des dispositifs ayant des composants montés sur une surface interne rencontrent souvent des problèmes dus à la chaleur générée qui est difficile à dissiper d’une partie intérieure de dispositif scellée et compacte. Une chaleur excessive peut également déformer le matériau du substrat de la surface, qui peut devenir fragile suite aux contraintes thermiques accumulées et/ou se gauchir d’une manière qui déplace la position et/ou l’orientation des composants. La présente invention a trait à des techniques de fabrication de dispositif prenant en considération la température. Des dispositifs peuvent comprendre un boîtier de dispositif constitué d’un matériau de boîtier qui présente un coefficient de dilatation thermique (CTE) et/ou une conductivité thermique sensiblement isotropes dans diverses dimensions. Des dispositifs peuvent également comprendre un support de boîtier pour un groupe de composants qui peut être monté sur la surface interne du boîtier, avec des tracés électroconducteurs intégrés au boîtier qui interconnectent de manière conductrice le support de boîtier au groupe de composants et générés éventuellement par activation laser d’un additif conducteur ou par dépôt de matériaux conducteurs.
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: English (EN)
Filing Language: English (EN)