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1. (WO2018128733) CIRCUITS FOR AND METHODS OF IMPLEMENTING AN INDUCTOR AND A PATTERN GROUND SHIELD IN AN INTEGRATED CIRCUIT

Pub. No.:    WO/2018/128733    International Application No.:    PCT/US2017/064022
Publication Date: Fri Jul 13 01:59:59 CEST 2018 International Filing Date: Fri Dec 01 00:59:59 CET 2017
IPC: H01L 23/522
Applicants: XILINX, INC.
Inventors: UPADHYAYA, Parag
JING, Jing
Title: CIRCUITS FOR AND METHODS OF IMPLEMENTING AN INDUCTOR AND A PATTERN GROUND SHIELD IN AN INTEGRATED CIRCUIT
Abstract:
An integrated circuit device is described. The integrated circuit device comprises a substrate (202); a plurality of metal routing interconnect layers (710, 712, 716); an inductor (108) formed in at least one metal layer of the plurality of metal routing interconnect layers; and a bottom metal layer (702) between the plurality of metal routing interconnect layers and the substrate; wherein a pattern ground shield (302) is formed in the bottom metal layer. A method of implementing an inductor in an integrated circuit device is also disclosed.