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1. (WO2018128634) METHOD, APPARATUS, AND TARGET FOR MATERIAL DEPOSITION ON A SUBSTRATE IN A VACUUM DEPOSITION PROCESS

Pub. No.:    WO/2018/128634    International Application No.:    PCT/US2017/012741
Publication Date: Fri Jul 13 01:59:59 CEST 2018 International Filing Date: Tue Jan 10 00:59:59 CET 2017
IPC: C23C 14/56
C23C 14/34
C23C 14/35
H01J 37/34
Applicants: APPLIED MATERIALS, INC.
Inventors: HOSOKAWA, Aki
Title: METHOD, APPARATUS, AND TARGET FOR MATERIAL DEPOSITION ON A SUBSTRATE IN A VACUUM DEPOSITION PROCESS
Abstract:
The present disclosure provides a method for material deposition on a substrate in a vacuum deposition process having a sputtering target is provided. The method includes providing a target temperature of the sputtering target during operation to be within a desired target temperature range for adjusting a gap width of a gap of two adjacent target segments of the sputtering target.