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1. (WO2018128433) METAL PAD INTERFACE
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Pub. No.: WO/2018/128433 International Application No.: PCT/KR2018/000211
Publication Date: 12.07.2018 International Filing Date: 04.01.2018
IPC:
H01R 12/59 (2011.01) ,H01R 12/70 (2011.01) ,H01R 13/24 (2006.01)
[IPC code unknown for H01R 12/59][IPC code unknown for H01R 12/70][IPC code unknown for H01R 13/24]
Applicants:
조인셋 주식회사 JOINSET CO., LTD. [KR/KR]; 경기도 안산시 단원구 해안로 329, 반월공단 9블록 51롯트 (초지동) (Choji-dong) 9B-51L Panwol Industrial Complex, 329 Haean-ro, Danwon-gu, Ansan-si, Gyeonggi-do 15613, KR
Inventors:
김선기 KIM, Sun-Ki; KR
Agent:
정현영 JUNG, Hyun-Young; KR
Priority Data:
10-2017-000263106.01.2017KR
Title (EN) METAL PAD INTERFACE
(FR) INTERFACE DE PASTILLE MÉTALLIQUE
(KO) 금속패드 인터페이스
Abstract:
(EN) Disclosed is a metal pad interface which is soldered to an electrically conductive object and can provide reliable electrical connection to another electrically conductive object. The metal pad interface comprises: a body having a metal core, which is formed from copper or a copper alloy, and a nickel plating layer which is formed on the entire surface of the metal core; an upper contact portion which is formed by means of plating with gold or a gold alloy on the upper surface of the body; and a lower contact portion which is formed by means of plating with gold or a gold alloy on the lower surface of the body, wherein the lower contact portion is mounted on a divided land pattern of a circuit board by means of soldering and covers the land pattern, and an electrically conductive object from the outside comes in contact with and is electrically connected to the upper contact portion.
(FR) L'invention concerne une interface de pastille métallique qui est soudée à un objet électroconducteur et pouvant fournir une connexion électrique fiable à un autre objet électroconducteur. L'interface de pastille métallique comprend : un corps ayant un noyau métallique, qui est formé à partir de cuivre ou d'un alliage de cuivre, et une couche de placage de nickel qui est formée sur la totalité de la surface du noyau métallique; une partie de contact supérieure qui est formée par placage avec de l'or ou un alliage d'or sur la surface supérieure du corps; et une partie de contact inférieure qui est formée par placage avec de l'or ou un alliage d'or sur la surface inférieure du corps, la partie de contact inférieure étant montée sur un motif d'appui divisé d'une carte de circuit imprimé par soudure et recouvrant le motif d'appui, et un objet électroconducteur provenant de l'extérieur étant en contact avec la partie de contact supérieure et étant électriquement connecté à celle-ci.
(KO) 하나의 전기전도성 대상물에 솔더링 되어 다른 전기전도성 대상물과 신뢰성 있는 전기적 연결을 제공할 수 있는 금속패드 인터페이스가 개시된다. 금속패드 인터페이스는, 구리 또는 구리 합금의 금속 코어와, 상기 금속 코어의 전면에 형성된 니켈 도금층으로 구성된 본체; 상기 본체의 상면에 금 또는 금 합금으로 도금되어 형성된 상부 접촉부; 및 상기 본체의 하면에 금 또는 금 합금으로 도금되어 형성된 하부 접촉부를 포함하며, 상기 하부 접촉부는 회로기판의 분할된 랜드 패턴 위에 솔더링에 의해 실장되어 상기 랜드 패턴을 덮고, 상기 상부 접촉부에는 외부의 전기전도성 대상물이 접촉하여 전기적으로 연결된다.
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Korean (KO)
Filing Language: Korean (KO)