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|1. (WO2018128246) METHOD FOR FORMING FLEXIBLE SUBSTRATE INCLUDING VIA, AND FLEXIBLE SUBSTRATE HAVING VIA|
|Applicants:||SEOUL NATIONAL UNIVERSITY R&DB FOUNDATION
|Title:||METHOD FOR FORMING FLEXIBLE SUBSTRATE INCLUDING VIA, AND FLEXIBLE SUBSTRATE HAVING VIA|
A method for forming a flexible substrate having a via, according to the present embodiment, comprises the steps of: (a) arranging a mixture of conductive particles moving by means of a magnetic field, when a curable resin and the magnetic field are provided; (b) forming a material layer being cured and having flexibility; (c) arranging the conductive particles by providing a magnetic field; and (d) curing the curable resin and the material layer.