Search International and National Patent Collections

1. (WO2018128246) METHOD FOR FORMING FLEXIBLE SUBSTRATE INCLUDING VIA, AND FLEXIBLE SUBSTRATE HAVING VIA

Pub. No.:    WO/2018/128246    International Application No.:    PCT/KR2017/010448
Publication Date: Fri Jul 13 01:59:59 CEST 2018 International Filing Date: Sat Sep 23 01:59:59 CEST 2017
IPC: H01L 23/538
H01L 23/498
H01L 23/48
H01L 21/768
Applicants: SEOUL NATIONAL UNIVERSITY R&DB FOUNDATION
서울대학교산학협력단
Inventors: HONG, Yongtaek
홍용택
OH, Eunho
오은호
BYUN, Junghwan
변정환
LEE, Byeongmoon
이병문
Title: METHOD FOR FORMING FLEXIBLE SUBSTRATE INCLUDING VIA, AND FLEXIBLE SUBSTRATE HAVING VIA
Abstract:
A method for forming a flexible substrate having a via, according to the present embodiment, comprises the steps of: (a) arranging a mixture of conductive particles moving by means of a magnetic field, when a curable resin and the magnetic field are provided; (b) forming a material layer being cured and having flexibility; (c) arranging the conductive particles by providing a magnetic field; and (d) curing the curable resin and the material layer.