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1. (WO2018128122) INFRARED SENSOR MOUNTING MEMBER

Pub. No.:    WO/2018/128122    International Application No.:    PCT/JP2017/046574
Publication Date: Fri Jul 13 01:59:59 CEST 2018 International Filing Date: Wed Dec 27 00:59:59 CET 2017
IPC: G01J 1/02
G01J 5/02
H01L 37/00
H01L 37/02
Applicants: MITSUBISHI MATERIALS CORPORATION
三菱マテリアル株式会社
Inventors: SHIRATA Keiji
白田 敬治
HIRANO Shingo
平野 晋吾
Title: INFRARED SENSOR MOUNTING MEMBER
Abstract:
Provided is an infrared sensor mounting member that enables heat inside a cavity that houses heat sensitive elements to be effectively radiated to the outside. This infrared sensor mounting member enables an infrared sensor body 5, in which heat sensitive elements 3A, 3B and a plurality of terminal electrodes 4 are formed on an insulating substrate 2, to be mounted on a mounting substrate by fixing the sensor body to an upper part of the mounting member. The infrared sensor mounting member is equipped with an insulating mounting member body 6 and a plurality of conductive terminal members 7 that are attached to the mounting member body and have upper ends that are connected to the terminal electrodes and lower ends that will be connected to the mounting substrate at the time of mounting. The terminal members are formed of a material having a higher thermal conductivity than the mounting member body and each have a terminal pin part 7a that protrudes laterally. The mounting member body has terminal member hole parts 6a into which the terminal pin parts, which are formed on the side parts, are inserted and fixed in place, and element accommodating hole parts 8 that are formed in an upper part thereof, are disposed directly below the heat sensitive elements, and communicate with the terminal member hole parts.