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1. (WO2018128082) FLEXIBLE PRINTED WIRING BOARD

Pub. No.:    WO/2018/128082    International Application No.:    PCT/JP2017/045861
Publication Date: Fri Jul 13 01:59:59 CEST 2018 International Filing Date: Fri Dec 22 00:59:59 CET 2017
IPC: H05K 1/02
Applicants: SUMITOMO ELECTRIC PRINTED CIRCUITS, INC.
住友電工プリントサーキット株式会社
Inventors: UEDA Hiroshi
上田 宏
MIURA Kousuke
三浦 宏介
NOGUCHI Kou
野口 航
Title: FLEXIBLE PRINTED WIRING BOARD
Abstract:
A flexible printed wiring board according to one aspect of the present invention is a flexible printed wiring board provided with: a base film having insulation properties; and a conductive pattern that is laminated on at least one surface side of this base film and that includes a wire having a bent section with an angle of 60° or more or a branched section with an angle of 60° or more in plan view. The wire is provided with a mitigation structure for mitigating stress concentration on the bent section or the branched section. The mitigation structure is a structure in which a wire within a distance of five times or less a minimum width of the wire from the bent section or the branched section is a wide wire or dense wires. The wire width of the wide wire is twice or more the minimum width of the wire. The ratios of the wire widths of the dense wires with respect to the wire-to-wire spaces are 1.5 or more. The total width of the dense wires is twice or more the minimum width of the wire.