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1. (WO2018128037) MANUFACTURING METHOD FOR PRINTED WIRING BOARD
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Pub. No.: WO/2018/128037 International Application No.: PCT/JP2017/043443
Publication Date: 12.07.2018 International Filing Date: 04.12.2017
IPC:
H05K 3/18 (2006.01) ,H05K 1/02 (2006.01) ,H05K 3/06 (2006.01)
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3
Apparatus or processes for manufacturing printed circuits
10
in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
18
using precipitation techniques to apply the conductive material
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1
Printed circuits
02
Details
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3
Apparatus or processes for manufacturing printed circuits
02
in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
06
the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
Applicants:
住友電工プリントサーキット株式会社 SUMITOMO ELECTRIC PRINTED CIRCUITS, INC. [JP/JP]; 滋賀県甲賀市水口町ひのきが丘30番地 30, Hinokigaoka, Minakuchi-cho, Koka-shi, Shiga 5280068, JP
Inventors:
野口 航 NOGUCHI Kou; JP
上田 宏 UEDA Hiroshi; JP
Agent:
二島 英明 NISHIMA Hideaki; JP
中田 元己 NAKATA Motomi; JP
森田 剛史 MORITA Takeshi; JP
高城 政浩 TAKAGI Masahiro; JP
緒方 大介 OGATA Daisuke; JP
Priority Data:
2017-00061705.01.2017JP
Title (EN) MANUFACTURING METHOD FOR PRINTED WIRING BOARD
(FR) PROCÉDÉ DE FABRICATION DE CARTE DE CIRCUIT IMPRIMÉ
(JA) プリント配線板の製造方法
Abstract:
(EN) A manufacturing method for a printed wiring board according to one aspect of the present invention includes a step for forming a resist pattern, and a step for forming a conductive pattern by using the resist pattern. The resist pattern includes an acute angle portion where, in a plan view, an edge of the resist curves and forms an acute angle. In the angle section of this acute angle portion, the outside edge of the resist is rounded, and the radius of curvature of the outside edge is at least the distance from the outside edge to another edge adjacent in a direction away from the center of curvature of the outside edge.
(FR) Le procédé de fabrication d'une carte de circuit imprimé selon un aspect de la présente invention comprend les étapes consistant à former un motif de réserve, et à former un motif conducteur à l'aide du motif de réserve. Le motif de réserve comprend une partie d'angle aigu dans laquelle, en vue en plan, un bord de la réserve s'incurve et forme un angle aigu. Dans la section d'angle de cette partie d'angle aigu, le bord extérieur de la réserve est arrondi, et le rayon de courbure du bord extérieur est au moins égal à la distance entre le bord extérieur et un autre bord adjacent, en partant du centre de courbure du bord extérieur.
(JA) 本発明の一態様に係るプリント配線板の製造方法は、レジストパターンを形成する工程と、上記レジストパターンを用いて導電パターンを形成する工程とを備えるプリント配線板の製造方法である。上記レジストパターンは、平面視で、レジストの外縁が屈曲して鋭角をなしている鋭角部分を備える。上記鋭角部分の角部において、上記レジストの外側外縁は丸みを有し、上記外側外縁の曲率半径は、上記外側外縁から、上記外側外縁の曲率中心から離れる向きに隣接する他の外縁までの距離以上である。
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)