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1. WO2018127385 - METHOD FOR PRODUCING A MICROELECTROMECHANICAL COMPONENT, AND WAFER ASSEMBLY

Publication Number WO/2018/127385
Publication Date 12.07.2018
International Application No. PCT/EP2017/083069
International Filing Date 15.12.2017
IPC
B81B 7/00 2006.01
BPERFORMING OPERATIONS; TRANSPORTING
81MICROSTRUCTURAL TECHNOLOGY
BMICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
7Microstructural systems
CPC
B81B 2201/0264
BPERFORMING OPERATIONS; TRANSPORTING
81MICROSTRUCTURAL TECHNOLOGY
BMICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
2201Specific applications of microelectromechanical systems
02Sensors
0264Pressure sensors
B81B 2203/0127
BPERFORMING OPERATIONS; TRANSPORTING
81MICROSTRUCTURAL TECHNOLOGY
BMICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
2203Basic microelectromechanical structures
01Suspended structures, i.e. structures allowing a movement
0127Diaphragms, i.e. structures separating two media that can control the passage from one medium to another; Membranes, i.e. diaphragms with filtering function
B81B 2207/012
BPERFORMING OPERATIONS; TRANSPORTING
81MICROSTRUCTURAL TECHNOLOGY
BMICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
2207Microstructural systems or auxiliary parts thereof
01comprising a micromechanical device connected to control or processing electronics, i.e. Smart-MEMS
012the micromechanical device and the control or processing electronics being separate parts in the same package
B81B 2207/053
BPERFORMING OPERATIONS; TRANSPORTING
81MICROSTRUCTURAL TECHNOLOGY
BMICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
2207Microstructural systems or auxiliary parts thereof
05Arrays
053of movable structures
B81B 7/0025
BPERFORMING OPERATIONS; TRANSPORTING
81MICROSTRUCTURAL TECHNOLOGY
BMICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
7Microstructural systems; ; Auxiliary parts of microstructural devices or systems
0009Structural features, others than packages, for protecting a device against environmental influences
0025Protection against chemical alteration
B81B 7/0029
BPERFORMING OPERATIONS; TRANSPORTING
81MICROSTRUCTURAL TECHNOLOGY
BMICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
7Microstructural systems; ; Auxiliary parts of microstructural devices or systems
0009Structural features, others than packages, for protecting a device against environmental influences
0029Protection against environmental influences not provided for in groups B81B7/0012 - B81B7/0025
Applicants
  • ROBERT BOSCH GMBH [DE]/[DE]
Inventors
  • RAJARAMAN, Vijaye
  • SCHELLKES, Eckart
Priority Data
10 2017 200 162.309.01.2017DE
Publication Language German (DE)
Filing Language German (DE)
Designated States
Title
(DE) VERFAHREN ZUM HERSTELLEN EINES MIKROELEKTROMECHANISCHEN BAUTEILS UND WAFER-ANORDNUNG
(EN) METHOD FOR PRODUCING A MICROELECTROMECHANICAL COMPONENT, AND WAFER ASSEMBLY
(FR) PROCÉDÉ POUR PRODUIRE UN MICROCOMPOSANT ÉLECTROMÉCANIQUE ET ENSEMBLE PLAQUETTE
Abstract
(DE)
Die Erfindung schafft ein Verfahren zum Herstellen eines mikroelektromechanischen Bauteils sowie eine Waferanordnung.Das Verfahren umfasst die Schritte:Bereitstellen eines ersten Wafers mit einer Mehrzahl von mikroelektromechanischen Grundelementen (110a); Ausbilden einer jeweiligen Behälterstruktur (112a) auf oder an den mikroelektromechanischen Grundelementen (110a) auf Waferlevel; und Anordnen eines Öls (40) oder eines Gels innerhalb der Behälterstrukturen (112a).
(EN)
The invention relates to a method for producing a microelectromechanical component, and to a wafer assembly. The method comprises the following steps: providing a first wafer having a plurality of microelectromechanical base elements (110a); forming a container structure (112a) on top of or against each of the microelectromechanical base elements (110a) at the wafer level; and arranging an oil (40) or a gel within the container structures (112a).
(FR)
L'invention concerne un procédé pour produire un microcomposant électromécanique ainsi qu'un ensemble plaquette. Le procédé selon l'invention comprend les étapes consistant : à fournir une première plaquette comprenant une pluralité de micro-éléments électromécaniques de base (110a) ; à former une structure réceptacle (112a) respective sur ou contre les micro-éléments électromécaniques de base (110a) au niveau de la plaquette ; et à placer une huile (40) ou un gel dans les structures réceptacles (112a).
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